Product Information

W25Q32JVTCIM

W25Q32JVTCIM electronic component of Winbond

Datasheet
NOR Flash spiFlash 32M-bit DTR 4Kb Uniform Sector DTR

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.4622 ea
Line Total: USD 0.46

1387 - Global Stock
Ships to you between
Thu. 16 May to Wed. 22 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
731 - WHS 1


Ships to you between Thu. 16 May to Wed. 22 May

MOQ : 1
Multiples : 1

Stock Image

W25Q32JVTCIM
Winbond

1 : USD 0.3752

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Brand
Moisture Sensitive
Product Type
Factory Pack Quantity :
Subcategory
Tradename
LoadingGif

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W25Q32JV-DTR 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI & DTR Publication Release Date: March 27, 2018 Revision G W25Q32JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. ACKAGE TYPES AND PIN CONFIGURATIONS ............................................................................. 5 3.1 Pin Configuration SOIC 150 / 208-mil .................................................................................. 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm ............................................................ 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm .................................. 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.1 Ball Configuration TFBGA 8x6-mm (6x4 Ball Array) ............................................................ 7 3.2 Ball Description TFBGA 8x6-mm ......................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8 4.3 Write Protect (/WP) ............................................................................................................... 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 4.6 Reset (/RESET) .................................................................................................................... 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 SPI / QPI Operations .......................................................................................................... 10 Standard SPI Instructions ..................................................................................................... 10 Dual SPI Instructions ............................................................................................................ 10 Quad SPI Instructions ........................................................................................................... 11 QPI Instructions .................................................................................................................... 11 SPI / QPI DTR Read Instructions .......................................................................................... 11 Hold Function ........................................................................................................................ 11 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 Write Protect Features .......................................................................................................... 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 Status Registers .............................................................................................................................. 14 Erase/Write In Progress (BUSY) Status Only ................................................................. 14 Write Enable Latch (WEL) Status Only ........................................................................... 14 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 14 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 15 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 15 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 Status Register Protect (SRP, SRL) ..................................................................................... 16 Erase/Program Suspend Status (SUS) Status Only ....................................................... 17 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ......... 17 Quad Enable (QE) Volatile/Non-Volatile Writable ......................................................... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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