Product Information

W25Q32JVZPIQ TR

W25Q32JVZPIQ TR electronic component of Winbond

Datasheet
NOR Flash spiFlash, 32M-bit, DTR, 4Kb Uniform Sector
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

11: USD 0.9221 ea
Line Total: USD 10.14

574 - Global Stock
Ships to you between
Wed. 01 May to Tue. 07 May
MOQ: 11  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
574 - Global Stock


Ships to you between Wed. 01 May to Tue. 07 May

MOQ : 1
Multiples : 1
1 : USD 0.931
10 : USD 0.9221
25 : USD 0.7668
100 : USD 0.7514
250 : USD 0.7514
500 : USD 0.7514

574 - Global Stock


Ships to you between Wed. 01 May to Tue. 07 May

MOQ : 11
Multiples : 1
11 : USD 0.9221
25 : USD 0.8941
100 : USD 0.7593
250 : USD 0.744

Read More Specifications

     
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Additional Infomation About Product

W25Q32JV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI For Industrial & Industrial Plus Grade Publication Release Date: March 27, 2018 -Revision G W25Q32JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 150/208-mil & VSOP 208-mil ......................................................... 5 3.2 Pad Configuration WSON 6x5-mm/ 8X6-mm, XSON 4x4-mm ............................................ 5 3.3 Pin Description SOIC 150/208-mil, VSOP 208-mil, WSON 6x5-mm/8x6-mm, XSON 4x4- mm 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7 3.8 Pin Configuration PDIP 300-mil ............................................................................................ 8 3.9 Pin Description PDIP 300-mil ............................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP) ............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 (1) 4.6 Reset (/RESET) ................................................................................................................. 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 Standard SPI Instructions ................................................................................................... 11 6.2 Dual SPI Instructions .......................................................................................................... 11 6.3 Quad SPI Instructions......................................................................................................... 11 6.4 Software Reset & Hardware /RESET pin ........................................................................... 11 6.5 Write Protection .................................................................................................................. 12 Write Protect Features .......................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 13 7.1 Status Registers ................................................................................................................. 13 Erase/Write In Progress (BUSY) Status Only ................................................................. 13 Write Enable Latch (WEL) Status Only ........................................................................... 13 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 13 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 14 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 14 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 14 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ................................ 15 Erase/Program Suspend Status (SUS) Status Only ....................................................... 16 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ........... 16 Quad Enable (QE) Volatile/Non-Volatile Writable ........................................................... 16 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ........................................ 17 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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