Product Information

W25Q40CLSSIG

W25Q40CLSSIG electronic component of Winbond

Datasheet
NOR Flash spiFlash, 4M-bit, 4Kb Uniform Sector

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.4344 ea
Line Total: USD 0.43

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Warehouse 1


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 1
Multiples : 1

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W25Q40CLSSIG
Winbond

1 : USD 0.4344
1620 : USD 0.4022

0 - Warehouse 2


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1620
Multiples : 1620

Stock Image

W25Q40CLSSIG
Winbond

1620 : USD 0.3994
3240 : USD 0.3908
6480 : USD 0.359
11340 : USD 0.3529
25920 : USD 0.3444

     
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W25Q40CL 2.5/3/3.3V 4 M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI Publication Release Date: July 28, 2017 - 1 - Revision E W25Q40CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 3. PIN CONFIGURATION SOIC 150-MIL, VSOP 150-MIL, TSSOP 173-MIL ................................ 6 4. PAD CONFIGURATION USON 2X3-MM ................................................................................... 6 5. PIN DESCRIPTION SOIC 150-MIL ............................................................................................ 6 5.1 Package Types ............................................................................................................... 7 5.2 Chip Select (/CS) ............................................................................................................ 7 5.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 7 5.4 Write Protect (/WP) ......................................................................................................... 7 5.5 HOLD (/HOLD)................................................................................................................ 7 5.6 Serial Clock (CLK) .......................................................................................................... 7 6. BLOCK DIAGRAM ...................................................................................................................... 8 7. FUNCTIONAL DESCRIPTION.................................................................................................... 9 7.1 SPI OPERATIONS ......................................................................................................... 9 7.1.1 Standard SPI Instructions ................................................................................................. 9 7.1.2 Dual SPI Instructions ........................................................................................................ 9 7.1.3 Quad SPI Instructions....................................................................................................... 9 7.1.4 Hold Function ................................................................................................................... 9 7.2 WRITE PROTECTION .................................................................................................. 10 7.2.1 Write Protect Features .................................................................................................... 10 8. CONTROL AND STATUS REGISTERS ................................................................................... 11 8.1 STATUS REGISTER .................................................................................................... 11 8.1.1 BUSY .............................................................................................................................. 11 8.1.2 Write Enable Latch (WEL) .............................................................................................. 11 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 11 8.1.5 Sector/Block Protect (SEC) ............................................................................................ 11 8.1.6 Complement Protect (CMP) ........................................................................................... 11 8.1.7 Status Register Protect (SRP1, SRP0)........................................................................... 12 8.1.8 Erase/Program Suspend Status (SUS) .......................................................................... 12 8.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) .......................................................... 12 8.1.10 Quad Enable (QE) ........................................................................................................ 13 8.1.11 Status Register Memory Protection (CMP = 0) ............................................................. 14 8.1.12 Status Register Memory Protection (CMP = 1) ............................................................. 15 9. INSTRUCTIONS ....................................................................................................................... 16 9.1.1 Manufacturer and Device Identification .......................................................................... 16 9.1.2 Instruction Set Table 1 (Erase, Program Instructions) .................................................... 17 9.1.3 Instruction Set Table 2 (Read Instructions) .................................................................... 18 9.1.4 Instruction Set Table 3 (ID, Security Instructions) .......................................................... 19 9.1.5 Write Enable (06h).......................................................................................................... 20 9.1.6 Write Enable for Volatile Status Register (50h) .............................................................. 20 9.1.7 Write Disable (04h) ......................................................................................................... 21 9.1.8 Read Status Register-1 (05h) and Read Status Register-2 (35h) .................................. 21 Publication Release Date: July 28, 2017 - 2 - Revision E

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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