Product Information

902-21-2-12-2-B-0

902-21-2-12-2-B-0 electronic component of Wakefield

Datasheet
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 11.6mm Height, Aluminum
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 6.0737 ea
Line Total: USD 6.07

331 - Global Stock
Ships to you between
Mon. 13 May to Wed. 15 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
87 - Warehouse 1


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 5
Multiples : 5
5 : USD 9.66
25 : USD 7.9537
90 : USD 7.6125
180 : USD 7.4156
270 : USD 7.035
540 : USD 6.93
1080 : USD 6.5231
2520 : USD 6.4181

331 - Warehouse 2


Ships to you between Mon. 13 May to Wed. 15 May

MOQ : 1
Multiples : 1
1 : USD 6.0737
10 : USD 5.9167
25 : USD 5.8322
1080 : USD 5.7719

28 - Warehouse 3


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 1
Multiples : 1
1 : USD 8.422
3 : USD 7.4939
7 : USD 7.0843
90 : USD 7.0024

87 - Warehouse 4


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 10
Multiples : 5
10 : USD 12.5618
25 : USD 10.068
90 : USD 9.4683

87 - Warehouse 5


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 10
Multiples : 5
10 : USD 12.5618
25 : USD 10.068
90 : USD 9.4683

28 - Warehouse 6


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 9
Multiples : 1
9 : USD 10.3476

Read More Specifications

     
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Additional Infomation About Product

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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