Product Information

903-23-2-15-2-B-0

903-23-2-15-2-B-0 electronic component of Wakefield

Datasheet
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 14.6mm Height, Aluminum
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 8.211 ea
Line Total: USD 8.21

334 - Global Stock
Ships to you between
Mon. 13 May to Wed. 15 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
339 - WHS 1


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 5
Multiples : 5
5 : USD 10.2769
25 : USD 8.6888
90 : USD 7.2713
180 : USD 7.2319
270 : USD 6.7462
540 : USD 6.615
1080 : USD 6.5887
2520 : USD 6.5494

334 - WHS 2


Ships to you between Mon. 13 May to Wed. 15 May

MOQ : 1
Multiples : 1
1 : USD 8.211
10 : USD 7.9936
25 : USD 7.5831
50 : USD 7.1846
90 : USD 6.6292
270 : USD 6.3635
540 : USD 6.2428

339 - WHS 3


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 10
Multiples : 5
10 : USD 14.1831
25 : USD 11.148
90 : USD 10.4478
180 : USD 9.8197
270 : USD 9.3227

339 - WHS 4


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 10
Multiples : 5
10 : USD 14.1831
25 : USD 11.148
90 : USD 10.4478
180 : USD 9.8197
270 : USD 9.3227

Read More Specifications

     
Manufacturer
Product Category
Length
Width
Height
Colour
Material
Type Of Heatsink
Material Finishing
Heatsink Shape
Application
Thermal Resistance @200 Lfm
Manufacturer Series
LoadingGif

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Additional Infomation About Product

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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