Product Information

906-31-1-23-2-B-0

906-31-1-23-2-B-0 electronic component of Wakefield

Datasheet
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 22.6mm Height, Aluminum
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3: USD 5.2471 ea
Line Total: USD 15.74

0 - Global Stock
MOQ: 3  Multiples: 3
Pack Size: 3

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 10
Multiples : 1
10 : USD 7.5034
25 : USD 7.0857
50 : USD 6.6682
100 : USD 6.264
250 : USD 5.833
500 : USD 5.4153
1000 : USD 5.3076

0 - WHS 2


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 3
Multiples : 3
3 : USD 5.2471
10 : USD 4.7042
25 : USD 4.5233
75 : USD 4.5233
150 : USD 4.3424

0 - WHS 3


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1
1 : USD 10.1286
10 : USD 10.0165
25 : USD 9.4559
50 : USD 9.269
90 : USD 8.5713
270 : USD 8.0107
540 : USD 7.9235
1080 : USD 7.8363

0 - WHS 4


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1
1 : USD 11.1382
2 : USD 8.5113
6 : USD 8.0409

0 - WHS 5


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 11
Multiples : 1
11 : USD 8.2213
25 : USD 7.7669

Read More Specifications

     
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Heatsink Material
Fin Style
Thermal Resistance
Height
Designed for
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Additional Infomation About Product

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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