Product Information

904-27-1-23-2-B-0

904-27-1-23-2-B-0 electronic component of Wakefield

Datasheet
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 22.6mm Height, Aluminum
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 8.8952 ea
Line Total: USD 8.9

258 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
77 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 5
Multiples : 5
5 : USD 10.6444
25 : USD 8.7544
90 : USD 8.3869
180 : USD 8.0588
270 : USD 7.7438
540 : USD 7.6387
1080 : USD 7.1794
2520 : USD 6.93

258 - WHS 2


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1
1 : USD 8.8952
10 : USD 8.6585
25 : USD 8.3097
50 : USD 8.1726
90 : USD 7.4625
270 : USD 6.9019
540 : USD 6.7649

77 - WHS 3


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 10
Multiples : 5
10 : USD 11.2941

Read More Specifications

     
Manufacturer
Product Category
Length
Width
Height
Colour
Material
Type Of Heatsink
Material Finishing
Heatsink Shape
Application
Thermal Resistance @200 Lfm
Manufacturer Series
LoadingGif

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Additional Infomation About Product

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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