Product Information

906-31-1-12-2-B-0

906-31-1-12-2-B-0 electronic component of Wakefield

Datasheet
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 11.6mm Height, Aluminum
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.1286 ea
Line Total: USD 10.13

97 - Global Stock
Ships to you between
Fri. 31 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
174 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 5
Multiples : 5
5 : USD 12.6394
25 : USD 10.2112
90 : USD 9.7388
180 : USD 9.3056
270 : USD 8.9119
540 : USD 8.6625
1080 : USD 8.2163
2520 : USD 7.8881

97 - WHS 2


Ships to you between Fri. 31 May to Tue. 04 Jun

MOQ : 1
Multiples : 1
1 : USD 10.1286
10 : USD 10.0289
25 : USD 9.1818
50 : USD 9.1444
90 : USD 8.3097
270 : USD 7.9235
540 : USD 7.6494
1080 : USD 7.475
2520 : USD 7.3504

174 - WHS 3


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 10
Multiples : 5
10 : USD 17.0936
25 : USD 13.4426
90 : USD 12.5975
180 : USD 11.8312

Read More Specifications

     
Manufacturer
Product Category
Length
Width
Height
Colour
Material
Type Of Heatsink
Material Finishing
Heatsink Shape
Application
Thermal Resistance @200 Lfm
Manufacturer Series
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Additional Infomation About Product

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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