Product Information

W9712G6KB25I TR

W9712G6KB25I TR electronic component of Winbond

Datasheet
DRAM 128Mb DDR2-800, x16 T&R

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.392 ea
Line Total: USD 2.39

2400 - Global Stock
Ships to you between
Fri. 10 May to Tue. 14 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2400 - Global Stock


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1
Multiples : 1
1 : USD 2.392
10 : USD 2.1735
100 : USD 1.932
500 : USD 1.8745
1000 : USD 1.7595
2500 : USD 1.748
5000 : USD 1.6675
10000 : USD 1.633
25000 : USD 1.6215

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Mounting Style
Package / Case
Data Bus Width
Memory Size
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Organization
Brand
Hts Code
Product Type
Factory Pack Quantity :
Subcategory
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W971GG8SB25I electronic component of Winbond W971GG8SB25I

DRAM Chip DDR4 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
Stock : 0

W971GG8SB-25 electronic component of Winbond W971GG8SB-25

DRAM 1Gb, DDR2-800, x8
Stock : 0

W971GG8KB25I electronic component of Winbond W971GG8KB25I

DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
Stock : 0

W971GG6KB25I electronic component of Winbond W971GG6KB25I

DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin WBGA
Stock : 0

W971GG6KB-25 electronic component of Winbond W971GG6KB-25

DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin WBGA
Stock : 0

W9725G6KB-25 electronic component of Winbond W9725G6KB-25

DRAM Chip DDR2 SDRAM 256Mbit 16Mx16 1.8V 84-Pin WBGA
Stock : 38

W971GG6SB-25 electronic component of Winbond W971GG6SB-25

8M X 8 Banks X 16 BIT DDR2 SDRAM
Stock : 0

W971GG6SB25I electronic component of Winbond W971GG6SB25I

DRAM 1Gb, DDR2-800, x16, Ind temp
Stock : 390

W971GG6SB-25TR electronic component of Winbond W971GG6SB-25TR

DDR DRAM 1Gb (64M x 16) Parallel WBGA-84 RoHS
Stock : 0

W971GG6SB-18 electronic component of Winbond W971GG6SB-18

DRAM 1Gb, DDR2-1066, x16
Stock : 0

Image Description
MT40A1G8WE-083E IT:B electronic component of Micron MT40A1G8WE-083E IT:B

DRAM Chip DDR4 SDRAM 8G-Bit 1Gx8 1.2V 78-Pin FBGA
Stock : 0

MT40A1G8WE-075E:B electronic component of Micron MT40A1G8WE-075E:B

DRAM Chip DDR4 SDRAM 8G-Bit 1Gx8 1.2V 78-Pin FBGA
Stock : 0

MT40A512M16JY-083E AUT:B electronic component of Micron MT40A512M16JY-083E AUT:B

MICMT40A512M16JY-083E AUT:B
Stock : 0

MT53D1024M32D4DT-053 WT:D electronic component of Micron MT53D1024M32D4DT-053 WT:D

DRAM LPDDR4 32G 1GX32 FBGA QDP
Stock : 0

EDB8164B4PT-1DAT-F-D electronic component of Micron EDB8164B4PT-1DAT-F-D

DRAM Chip LPDDR2 SDRAM 8Gbit 128M X 64 256-Ball BGA T/R
Stock : 0

MT40A256M16GE-083E AAT:B electronic component of Micron MT40A256M16GE-083E AAT:B

DDR4 4G 256MX16 FBGA
Stock : 0

AS4C128M8D3B-12BCN electronic component of Alliance Memory AS4C128M8D3B-12BCN

DRAM Chip DDR3 SDRAM 1Gbit 128M X 8 78-Pin FBGA Tray
Stock : 349

MT46H32M32LFB5-5 IT:B electronic component of Micron MT46H32M32LFB5-5 IT:B

DRAM Chip Mobile LPDDR SDRAM 1G-Bit 32Mx32 1.8V 90-Pin VF-BGA Tray
Stock : 1

MT40A2G4SA-062E:J TR electronic component of Micron MT40A2G4SA-062E:J TR

DRAM DDR4 8G 2GX4 FBGA
Stock : 1117

MT40A1G8SA-062E:J TR electronic component of Micron MT40A1G8SA-062E:J TR

DRAM DDR4 8G 1GX8 FBGA
Stock : 0

W9712G6KB 2M 4 BANKS 16 BIT DDR2 SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 4 2. FEATURES ........................................................................................................................................... 4 3. ORDER INFORMATION ....................................................................................................................... 4 4. KEY PARAMETERS ............................................................................................................................. 5 5. BALL CONFIGURATION ...................................................................................................................... 6 6. BALL DESCRIPTION ............................................................................................................................ 7 7. BLOCK DIAGRAM ................................................................................................................................ 8 8. FUNCTIONAL DESCRIPTION .............................................................................................................. 9 8.1 Power-up and Initialization Sequence ................................................................................................... 9 8.2 Mode Register and Extended Mode Registers Operation ................................................................... 10 8.2.1 Mode Register Set Command (MRS)............................................................................... 10 8.2.2 Extend Mode Register Set Commands (EMRS) .............................................................. 11 8.2.2.1 Extend Mode Register Set Command (1), EMR (1) ................................................ 11 8.2.2.2 DLL Enable/Disable ................................................................................................ 12 8.2.2.3 Extend Mode Register Set Command (2), EMR (2) ................................................ 13 8.2.2.4 Extend Mode Register Set Command (3), EMR (3) ................................................ 14 8.2.3 Off-Chip Driver (OCD) Impedance Adjustment ................................................................ 15 8.2.3.1 Extended Mode Register for OCD Impedance Adjustment .................................... 16 8.2.3.2 OCD Impedance Adjust .......................................................................................... 16 8.2.3.3 Drive Mode ............................................................................................................. 17 8.2.4 On-Die Termination (ODT) ............................................................................................... 18 8.2.5 ODT related timings ......................................................................................................... 18 8.2.5.1 MRS command to ODT update delay ..................................................................... 18 8.3 Command Function ............................................................................................................................. 20 8.3.1 Bank Activate Command .................................................................................................. 20 8.3.2 Read Command ............................................................................................................... 20 8.3.3 Write Command ............................................................................................................... 21 8.3.4 Burst Read with Auto-precharge Command ..................................................................... 21 8.3.5 Burst Write with Auto-precharge Command ..................................................................... 21 8.3.6 Precharge All Command .................................................................................................. 21 8.3.7 Self Refresh Entry Command .......................................................................................... 21 8.3.8 Self Refresh Exit Command ............................................................................................. 22 8.3.9 Refresh Command ........................................................................................................... 22 8.3.10 No-Operation Command .................................................................................................. 23 8.3.11 Device Deselect Command .............................................................................................. 23 8.4 Read and Write access modes ........................................................................................................... 23 8.4.1 Posted CAS ................................................................................................................... 23 CAS 8.4.1.1 Examples of posted operation ..................................................................... 23 8.4.2 Burst mode operation ....................................................................................................... 24 8.4.3 Burst read mode operation ............................................................................................... 25 8.4.4 Burst write mode operation .............................................................................................. 25 8.4.5 Write data mask ............................................................................................................... 26 8.5 Burst Interrupt ..................................................................................................................................... 26 8.6 Precharge operation ............................................................................................................................ 27 Publication Release Date: Apr. 13, 2018 Revision: A06 - 1 - W9712G6KB 8.6.1 Burst read operation followed by precharge ..................................................................... 27 8.6.2 Burst write operation followed by precharge .................................................................... 27 8.7 Auto-precharge operation ................................................................................................................... 27 8.7.1 Burst read with Auto-precharge ....................................................................................... 28 8.7.2 Burst write with Auto-precharge ....................................................................................... 28 8.8 Refresh Operation ............................................................................................................................... 29 8.9 Power Down Mode .............................................................................................................................. 29 8.9.1 Power Down Entry ........................................................................................................... 30 8.9.2 Power Down Exit .............................................................................................................. 30 8.10 Input clock frequency change during precharge power down ............................................................. 30 9. OPERATION MODE ........................................................................................................................... 31 9.1 Command Truth Table ........................................................................................................................ 31 9.2 Clock Enable (CKE) Truth Table for Synchronous Transitions ........................................................... 32 9.3 Data Mask (DM) Truth Table ............................................................................................................... 32 9.4 Function Truth Table ........................................................................................................................... 33 9.5 Simplified Stated Diagram ................................................................................................................... 36 10. ELECTRICAL CHARACTERISTICS ................................................................................................... 37 10.1 Absolute Maximum Ratings ................................................................................................................ 37 10.2 Operating Temperature Condition ....................................................................................................... 37 10.3 Recommended DC Operating Conditions ........................................................................................... 37 10.4 ODT DC Electrical Characteristics ...................................................................................................... 38 10.5 Input DC Logic Level ........................................................................................................................... 38 10.6 Input AC Logic Level ........................................................................................................................... 38 10.7 Capacitance ........................................................................................................................................ 39 10.8 Leakage and Output Buffer Characteristics ........................................................................................ 39 10.9 DC Characteristics .............................................................................................................................. 40 10.10 IDD Measurement Test Parameters .......................................................................................... 42 10.11 AC Characteristics ..................................................................................................................... 43 10.12 AC Input Test Conditions ........................................................................................................... 64 10.13 Differential Input/Output AC Logic Levels .................................................................................. 64 10.14 AC Overshoot / Undershoot Specification ................................................................................. 65 10.14.1 AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 65 10.14.2 AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 65 11. TIMING WAVEFORMS ....................................................................................................................... 66 11.1 Command Input Timing ....................................................................................................................... 66 11.2 ODT Timing for Active/Standby Mode ................................................................................................. 67 11.3 ODT Timing for Power Down Mode .................................................................................................... 67 11.4 ODT Timing mode switch at entering power down mode .................................................................... 68 11.5 ODT Timing mode switch at exiting power down mode ...................................................................... 69 11.6 Data output (read) timing .................................................................................................................... 70 11.7 Burst read operation: RL=5 (AL=2, CL=3, BL=4) ................................................................................ 70 11.8 Data input (write) timing ...................................................................................................................... 71 11.9 Burst write operation: RL=5 (AL=2, CL=3, WL=4, BL=4) .................................................................... 71 11.10 Seamless burst read operation: RL = 5 ( AL = 2, and CL = 3, BL = 4) ...................................... 72 11.11 Seamless burst write operation: RL = 5 ( WL = 4, BL = 4) ......................................................... 72 11.12 Burst read interrupt timing: RL =3 (CL=3, AL=0, BL=8) ............................................................. 73 11.13 Burst write interrupt timing: RL=3 (CL=3, AL=0, WL=2, BL=8) .................................................. 73 11.14 Write operation with Data Mask: WL=3, AL=0, BL=4) ............................................................... 74 11.15 Burst read operation followed by precharge: RL=4 (AL=1, CL=3, BL=4, tRTP 2clks) ............ 75 11.16 Burst read operation followed by precharge: RL=4 (AL=1, CL=3, BL=8, tRTP 2clks) ............ 75 Publication Release Date: Apr. 13, 2018 Revision: A06 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted