Product Information

W9712G6KB-25

W9712G6KB-25 electronic component of Winbond

Datasheet
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.07 ea
Line Total: USD 2.07

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 15 May to Tue. 21 May

MOQ : 209
Multiples : 1

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W9712G6KB-25
Winbond

209 : USD 1.9526
418 : USD 1.9194
1045 : USD 1.8416
2508 : USD 1.752
5016 : USD 1.7295

0 - WHS 2


Ships to you between Wed. 15 May to Tue. 21 May

MOQ : 209
Multiples : 1

Stock Image

W9712G6KB-25
Winbond

209 : USD 1.9526
418 : USD 1.9194
1045 : USD 1.8416
2508 : USD 1.752
5016 : USD 1.7295

0 - WHS 3


Ships to you between Tue. 21 May to Thu. 23 May

MOQ : 1
Multiples : 1

Stock Image

W9712G6KB-25
Winbond

1 : USD 2.07
10 : USD 1.8975
100 : USD 1.6905
418 : USD 1.656
1045 : USD 1.5985
2508 : USD 1.518
5016 : USD 1.518
10032 : USD 1.472
25080 : USD 1.403

0 - WHS 4


Ships to you between Wed. 15 May to Tue. 21 May

MOQ : 6
Multiples : 1

Stock Image

W9712G6KB-25
Winbond

6 : USD 1.9517
10 : USD 1.944
100 : USD 1.8835
209 : USD 1.7909
418 : USD 1.7664
1045 : USD 1.731

     
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W9712G6KB 2M 4 BANKS 16 BIT DDR2 SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 4 2. FEATURES ........................................................................................................................................... 4 3. ORDER INFORMATION ....................................................................................................................... 4 4. KEY PARAMETERS ............................................................................................................................. 5 5. BALL CONFIGURATION ...................................................................................................................... 6 6. BALL DESCRIPTION ............................................................................................................................ 7 7. BLOCK DIAGRAM ................................................................................................................................ 8 8. FUNCTIONAL DESCRIPTION .............................................................................................................. 9 8.1 Power-up and Initialization Sequence ................................................................................................... 9 8.2 Mode Register and Extended Mode Registers Operation ................................................................... 10 8.2.1 Mode Register Set Command (MRS)............................................................................... 10 8.2.2 Extend Mode Register Set Commands (EMRS) .............................................................. 11 8.2.2.1 Extend Mode Register Set Command (1), EMR (1) ................................................ 11 8.2.2.2 DLL Enable/Disable ................................................................................................ 12 8.2.2.3 Extend Mode Register Set Command (2), EMR (2) ................................................ 13 8.2.2.4 Extend Mode Register Set Command (3), EMR (3) ................................................ 14 8.2.3 Off-Chip Driver (OCD) Impedance Adjustment ................................................................ 15 8.2.3.1 Extended Mode Register for OCD Impedance Adjustment .................................... 16 8.2.3.2 OCD Impedance Adjust .......................................................................................... 16 8.2.3.3 Drive Mode ............................................................................................................. 17 8.2.4 On-Die Termination (ODT) ............................................................................................... 18 8.2.5 ODT related timings ......................................................................................................... 18 8.2.5.1 MRS command to ODT update delay ..................................................................... 18 8.3 Command Function ............................................................................................................................. 20 8.3.1 Bank Activate Command .................................................................................................. 20 8.3.2 Read Command ............................................................................................................... 20 8.3.3 Write Command ............................................................................................................... 21 8.3.4 Burst Read with Auto-precharge Command ..................................................................... 21 8.3.5 Burst Write with Auto-precharge Command ..................................................................... 21 8.3.6 Precharge All Command .................................................................................................. 21 8.3.7 Self Refresh Entry Command .......................................................................................... 21 8.3.8 Self Refresh Exit Command ............................................................................................. 22 8.3.9 Refresh Command ........................................................................................................... 22 8.3.10 No-Operation Command .................................................................................................. 23 8.3.11 Device Deselect Command .............................................................................................. 23 8.4 Read and Write access modes ........................................................................................................... 23 8.4.1 Posted CAS ................................................................................................................... 23 CAS 8.4.1.1 Examples of posted operation ..................................................................... 23 8.4.2 Burst mode operation ....................................................................................................... 24 8.4.3 Burst read mode operation ............................................................................................... 25 8.4.4 Burst write mode operation .............................................................................................. 25 8.4.5 Write data mask ............................................................................................................... 26 8.5 Burst Interrupt ..................................................................................................................................... 26 8.6 Precharge operation ............................................................................................................................ 27 Publication Release Date: Apr. 13, 2018 Revision: A06 - 1 - W9712G6KB 8.6.1 Burst read operation followed by precharge ..................................................................... 27 8.6.2 Burst write operation followed by precharge .................................................................... 27 8.7 Auto-precharge operation ................................................................................................................... 27 8.7.1 Burst read with Auto-precharge ....................................................................................... 28 8.7.2 Burst write with Auto-precharge ....................................................................................... 28 8.8 Refresh Operation ............................................................................................................................... 29 8.9 Power Down Mode .............................................................................................................................. 29 8.9.1 Power Down Entry ........................................................................................................... 30 8.9.2 Power Down Exit .............................................................................................................. 30 8.10 Input clock frequency change during precharge power down ............................................................. 30 9. OPERATION MODE ........................................................................................................................... 31 9.1 Command Truth Table ........................................................................................................................ 31 9.2 Clock Enable (CKE) Truth Table for Synchronous Transitions ........................................................... 32 9.3 Data Mask (DM) Truth Table ............................................................................................................... 32 9.4 Function Truth Table ........................................................................................................................... 33 9.5 Simplified Stated Diagram ................................................................................................................... 36 10. ELECTRICAL CHARACTERISTICS ................................................................................................... 37 10.1 Absolute Maximum Ratings ................................................................................................................ 37 10.2 Operating Temperature Condition ....................................................................................................... 37 10.3 Recommended DC Operating Conditions ........................................................................................... 37 10.4 ODT DC Electrical Characteristics ...................................................................................................... 38 10.5 Input DC Logic Level ........................................................................................................................... 38 10.6 Input AC Logic Level ........................................................................................................................... 38 10.7 Capacitance ........................................................................................................................................ 39 10.8 Leakage and Output Buffer Characteristics ........................................................................................ 39 10.9 DC Characteristics .............................................................................................................................. 40 10.10 IDD Measurement Test Parameters .......................................................................................... 42 10.11 AC Characteristics ..................................................................................................................... 43 10.12 AC Input Test Conditions ........................................................................................................... 64 10.13 Differential Input/Output AC Logic Levels .................................................................................. 64 10.14 AC Overshoot / Undershoot Specification ................................................................................. 65 10.14.1 AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 65 10.14.2 AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 65 11. TIMING WAVEFORMS ....................................................................................................................... 66 11.1 Command Input Timing ....................................................................................................................... 66 11.2 ODT Timing for Active/Standby Mode ................................................................................................. 67 11.3 ODT Timing for Power Down Mode .................................................................................................... 67 11.4 ODT Timing mode switch at entering power down mode .................................................................... 68 11.5 ODT Timing mode switch at exiting power down mode ...................................................................... 69 11.6 Data output (read) timing .................................................................................................................... 70 11.7 Burst read operation: RL=5 (AL=2, CL=3, BL=4) ................................................................................ 70 11.8 Data input (write) timing ...................................................................................................................... 71 11.9 Burst write operation: RL=5 (AL=2, CL=3, WL=4, BL=4) .................................................................... 71 11.10 Seamless burst read operation: RL = 5 ( AL = 2, and CL = 3, BL = 4) ...................................... 72 11.11 Seamless burst write operation: RL = 5 ( WL = 4, BL = 4) ......................................................... 72 11.12 Burst read interrupt timing: RL =3 (CL=3, AL=0, BL=8) ............................................................. 73 11.13 Burst write interrupt timing: RL=3 (CL=3, AL=0, WL=2, BL=8) .................................................. 73 11.14 Write operation with Data Mask: WL=3, AL=0, BL=4) ............................................................... 74 11.15 Burst read operation followed by precharge: RL=4 (AL=1, CL=3, BL=4, tRTP 2clks) ............ 75 11.16 Burst read operation followed by precharge: RL=4 (AL=1, CL=3, BL=8, tRTP 2clks) ............ 75 Publication Release Date: Apr. 13, 2018 Revision: A06 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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