Product Information

W25Q80DVSSIG

W25Q80DVSSIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 3.3V 8M-bit 1M x 8 6ns 8-Pin SOIC W

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5: USD 0.2977 ea
Line Total: USD 1.49

17139 - Global Stock
Ships to you between
Fri. 31 May to Wed. 05 Jun
MOQ: 5  Multiples: 5
Pack Size: 5
Availability Price Quantity
2512 - WHS 1


Ships to you between
Fri. 31 May to Wed. 05 Jun

MOQ : 5
Multiples : 5

Stock Image

W25Q80DVSSIG
Winbond

5 : USD 0.3334
50 : USD 0.2665
150 : USD 0.2332
500 : USD 0.2081
2000 : USD 0.2036
4000 : USD 0.1936

17139 - WHS 2


Ships to you between
Fri. 31 May to Wed. 05 Jun

MOQ : 5
Multiples : 5

Stock Image

W25Q80DVSSIG
Winbond

5 : USD 0.2977
50 : USD 0.2403
180 : USD 0.2329
540 : USD 0.2086
2520 : USD 0.2001
5040 : USD 0.1943

34477 - WHS 3


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

W25Q80DVSSIG
Winbond

1 : USD 0.498
10 : USD 0.4473
90 : USD 0.4014
540 : USD 0.3887
1080 : USD 0.3806
2520 : USD 0.3611

351 - WHS 4


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 20
Multiples : 1

Stock Image

W25Q80DVSSIG
Winbond

20 : USD 0.4432
25 : USD 0.4206
90 : USD 0.412
270 : USD 0.4013
540 : USD 0.3932

25461 - WHS 5


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 23
Multiples : 1

Stock Image

W25Q80DVSSIG
Winbond

23 : USD 0.4921
25 : USD 0.4563
90 : USD 0.4432
270 : USD 0.4269
540 : USD 0.4183

     
Manufacturer
Product Category
Mounting Style
Package / Case
Interface Type
Organisation
Timing Type
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Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Access Time Max
Address Bus
Pin Count
Operating Temperature Classification
Density
Operating Supply Voltage Typ
Operating Temp Range
Rad Hardened
Program/Erase Volt Typ
Programmable
Boot Type
Cell Type
Brand Category
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W25Q80DV/DL 2.5V AND 3V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date:October 02, 2015 - 1 - Preli mry-Revision H W25Q80DV/DL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..................................................................... 6 3.1 Pin Configuration SOIC 150-MIL/208-mil AND VSOP 150-mil: ...................................... 6 3.2 Pad Configuration WSON 6x5-mm, USON 2X3-mm...................................................... 6 3.3 Pin Configuration PDIP 300-mil ...................................................................................... 7 3.4 Pin Description SOIC/VSOP , WSON/USON & PDIP 300-mil ....................................... 7 3.5 Ball Configuration WLCSP .............................................................................................. 8 3.6 Ball Description WLCSP ................................................................................................. 8 4. PIN DESCRIPTIONS .................................................................................................................. 9 4.1 Chip Select (/CS) ............................................................................................................ 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 9 4.3 Write Protect (/WP) ......................................................................................................... 9 4.4 HOLD (/HOLD)................................................................................................................ 9 4.5 Serial Clock (CLK) .......................................................................................................... 9 5. BLOCK DIAGRAM .................................................................................................................... 10 6. FUNCTIONAL DESCRIPTION.................................................................................................. 11 6.1 SPI OPERATIONS ....................................................................................................... 11 6.1.1 Standard SPI Instructions ............................................................................................... 11 6.1.2 Dual SPI Instructions ...................................................................................................... 11 6.1.3 Quad SPI Instructions ..................................................................................................... 11 6.1.4 Hold Function .................................................................................................................. 11 6.2 WRITE PROTECTION .................................................................................................. 12 6.2.1 Write Protect Features .................................................................................................... 12 7. CONTROL AND STATUS REGISTERS ................................................................................... 13 7.1 STATUS REGISTER .................................................................................................... 13 7.1.1 BUSY .............................................................................................................................. 13 7.1.2 Write Enable Latch (WEL) .............................................................................................. 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 13 7.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 13 7.1.5 Sector/Block Protect (SEC) ............................................................................................. 13 7.1.6 Complement Protect (CMP) ............................................................................................ 14 7.1.7 Status Register Protect (SRP1, SRP0) ........................................................................... 14 7.1.8 Erase/Program Suspend Status (SUS) ........................................................................... 14 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) ................................................................... 14 7.1.10 Quad Enable (QE) ........................................................................................................ 15 7.1.11 Status Register Memory Protection (CMP = 0) ............................................................. 16 7.1.12 Status Register Memory Protection (CMP = 1) ............................................................. 17 8. INSTRUCTIONS ....................................................................................................................... 18 8.1 Manufacturer and Device Identification ........................................................................ 18 (1) 8.2 Instruction Set Table 1 (Standard SPI Instructions) .................................................. 19 8.3 Instruction Set Table 2 (Dual SPI Instructions) ............................................................. 20 8.4 Instruction Set Table 3 (Quad SPI Instructions) ........................................................... 20 8.5 Instruction Descriptions ................................................................................................ 22 Publication Release Date:October 02, 2015 - 2 - Preli mry-Revision H

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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