Product Information

W25Q80EWSNIG

W25Q80EWSNIG electronic component of Winbond

Datasheet
1.8V 8M-BIT Serial Flash Memory with Dual/Quad SPI and QPI
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.5844 ea
Line Total: USD 0.58

2231 - Global Stock
Ships to you between
Fri. 31 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
79 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

W25Q80EWSNIG
Winbond

1 : USD 0.5497
10 : USD 0.5115
25 : USD 0.5064
50 : USD 0.5003
100 : USD 0.4749
300 : USD 0.4589
500 : USD 0.4498
1000 : USD 0.4498
5000 : USD 0.4498

36 - WHS 2


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

W25Q80EWSNIG
Winbond

1 : USD 0.6615
10 : USD 0.5869
25 : USD 0.5811
50 : USD 0.5662
100 : USD 0.5216
300 : USD 0.495
500 : USD 0.485
1000 : USD 0.485
5000 : USD 0.485

2231 - WHS 3


Ships to you between Fri. 31 May to Tue. 04 Jun

MOQ : 1
Multiples : 1

Stock Image

W25Q80EWSNIG
Winbond

1 : USD 0.5844
10 : USD 0.5288
100 : USD 0.4806
500 : USD 0.4781
1000 : USD 0.466
2500 : USD 0.4612
5000 : USD 0.4298
10000 : USD 0.4287
25000 : USD 0.4262

Read More Specifications

     
Manufacturer
Product Category
Mounting Style
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Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Hts Code
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Additional Infomation About Product

W25Q80EW 1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: August 18, 2018 - 1 - inary -Revision J W25Q80EW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES: ........................................................................................................................... 6 3.1 Pin Configuration SOIC 150/208-mil AND VSOP 150-mil .................................................... 6 3.2 PAD Configuration WSON 6x5-MM AND USON 2x3-mm ................................................... 6 3.3 Pin Description SOIC150/208-mil, VSOP 150-mil, WSON 6x5-MM,USON 2x3 .................. 6 3.4 Ball Configuration WLCSP ................................................................................................... 7 3.5 Ball Description WLCSP ....................................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 4.3 Write Protect (/WP) .............................................................................................................. 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 10 6.1 SPI / QPI Operations .......................................................................................................... 10 6.2 SPI OPERATIONS ............................................................................................................. 10 6.2.1 Standard SPI Instructions ..................................................................................................... 10 6.2.2 Dual SPI Instructions ............................................................................................................ 10 6.2.3 Quad SPI Instructions ........................................................................................................... 11 6.3 QPI Instructions .................................................................................................................. 11 6.3.1 Hold Function ....................................................................................................................... 11 6.4 WRITE PROTECTION ....................................................................................................... 12 6.4.1 Write Protect Features ......................................................................................................... 12 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 13 7.1 STATUS REGISTERs ........................................................................................................ 13 7.1.1 BUSY Status (BUSY) Status Only .................................................................................. 13 7.1.2 Write Enable Latch Status (WEL) Status Only ............................................................... 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 13 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 13 7.1.5 Sector/Block Protect (SEC) Volatile/Non-Volatile Writable ............................................ 13 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 14 7.1.7 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 14 7.1.8 Erase/Program Suspend Status (SUS) Status Only ........................................................ 15 7.1.9 Security Register Lock Bits (LB 3:0 ) Volatile/Non-Volatile OTP Writable ...................... 15 - 2 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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