Product Information

W25Q16DVZPIG

W25Q16DVZPIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 3V/3.3V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

69: USD 0.9274 ea
Line Total: USD 63.99

0 - Global Stock
MOQ: 69  Multiples: 1
Pack Size: 1

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0 - WHS 1


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 69
Multiples : 1

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W25Q16DVZPIG
Winbond

69 : USD 0.9274
100 : USD 0.9008

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Additional Infomation About Product

W25Q16DV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 23, 2016 - 1 - Revision K W25Q16DV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC 150 / 208-mil .................................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / USON 4X3-mm / USON 4X4-mm .............................. 6 3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7 3.4 Pin Description SOIC 150/208-mil, WSON 6x5-mm / USON 4x3-mm / PDIP 300-mil ........ 7 3.5 Ball Configuration WLCSP ................................................................................................... 8 3.6 Ball Description WLCSP ....................................................................................................... 8 3.7 Pin Configuration SOIC 300-mil ........................................................................................... 9 3.8 Pin Description SOIC 300-mil ............................................................................................... 9 3.9 Ball Configuration TFBGA 8x6-mm .................................................................................... 10 3.10 Ball Description TFBGA 8x6-mm ....................................................................................... 10 4. PIN DESCRIPTIONS ...................................................................................................................... 11 4.1 Chip Select (/CS) ................................................................................................................ 11 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 11 4.3 Write Protect (/WP) ............................................................................................................ 11 4.4 HOLD (/HOLD) ................................................................................................................... 11 4.5 Serial Clock (CLK) .............................................................................................................. 11 5. BLOCK DIAGRAM .......................................................................................................................... 12 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 13 6.1 SPI OPERATIONS ............................................................................................................. 13 6.1.1 Standard SPI Instructions ..................................................................................................... 13 6.1.2 Dual SPI Instructions ............................................................................................................ 13 6.1.3 Quad SPI Instructions ........................................................................................................... 13 6.1.4 Hold Function ....................................................................................................................... 13 6.2 WRITE PROTECTION ....................................................................................................... 14 6.2.1 Write Protect Features ......................................................................................................... 14 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 15 7.1 STATUS REGISTERS ........................................................................................................ 15 7.1.1 BUSY Status (BUSY) ............................................................................................................ 15 7.1.2 Write Enable Latch Status (WEL) ........................................................................................ 15 7.1.3 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 15 7.1.4 Top/Bottom Block Protect Bit (TB) ........................................................................................ 15 7.1.5 Sector/Block Protect Bit (SEC) ............................................................................................. 15 7.1.6 Complement Protect Bit (CMP) ............................................................................................ 16 - 2 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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