Product Information

W25Q16FWZPIQ TR

W25Q16FWZPIQ TR electronic component of Winbond

Datasheet
NOR Flash spiFlash, 1.8V, 16M-bit, 4Kb Uniform Sector
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - Global Stock

MOQ : 1
Multiples : 1
1 : USD 0.035
10 : USD 0.0349
50 : USD 0.0343
250 : USD 0.0343
1000 : USD 0.0343
N/A

Obsolete
0 - Global Stock

MOQ : 1
Multiples : 1
1 : USD 1.6692
25 : USD 0.6633
100 : USD 0.5981
500 : USD 0.5959
1000 : USD 0.5753
2000 : USD 0.5165
5000 : USD 0.4905
10000 : USD 0.4817
N/A

Obsolete
0 - Global Stock

MOQ : 129
Multiples : 1
129 : USD 0.0343
N/A

Obsolete

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Additional Infomation About Product

W25Q16FW 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: May 18, 2017 - Revision J W25Q16FW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 5 3.1 Pin Configuration SOIC 150/208-mil AND VSOP 150-mil .................................................... 5 3.2 Pad Configuration WSON 6x5-mm / USON 4x3-mm / USON 2x3-mm ............................... 5 3.3 Pin Description SOIC 150/208-mil, VSOP 150mil, WSON 6x5mm, USON 4x3/ 2x3-mm ... 5 3.4 Ball Configuration WLCSP ................................................................................................... 6 3.5 Ball Description WLCSP ....................................................................................................... 6 4. PIN DESCRIPTIONS ........................................................................................................................ 7 4.1 Chip Select (/CS) .................................................................................................................. 7 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 7 4.3 Write Protect (/WP) .............................................................................................................. 7 4.4 HOLD (/HOLD) ..................................................................................................................... 7 4.5 Serial Clock (CLK) ................................................................................................................ 7 4.6 Reset (/RESET) .................................................................................................................... 7 5. BLOCK DIAGRAM ............................................................................................................................ 8 6. FUNCTIONAL DESCRIPTIONS ....................................................................................................... 9 6.1 SPI / QPI Operations ............................................................................................................ 9 6.1.1 Standard SPI Instructions ....................................................................................................... 9 6.1.2 Dual SPI Instructions .............................................................................................................. 9 6.1.3 Quad SPI Instructions ........................................................................................................... 10 6.1.4 QPI Instructions .................................................................................................................... 10 6.1.5 Hold Function ....................................................................................................................... 10 6.1.6 Software Reset & Hardware /RESET pin .............................................................................. 11 6.1.7 Write Protection .................................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 13 7.1 Status Registers ................................................................................................................. 13 7.1.1 Erase/Write In Progress (BUSY) Status Only .................................................................... 13 7.1.2 Write Enable Latch (WEL) Status Only ............................................................................. 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................... 13 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable .......................................... 14 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable .......................................... 14 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................... 14 7.1.7 Status Register Protect (SRP1, SRP0) Volatile/Non-Volatile Writable .............................. 14 7.1.8 Erase/Program Suspend Status (SUS) Status Only .......................................................... 15 7.1.9 Security Register Lock Bits(LB 3:1 ) Volatile/Non-Volatile OTP Writable .......................... 15 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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