Product Information

W25Q128FWSIG

W25Q128FWSIG electronic component of Winbond

Datasheet
NOR Flash spiFlash, 128M-bit, 4Kb Uniform Sector
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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W25Q128FWSIG
Winbond

1 : USD 4.5927
10 : USD 1.735
25 : USD 1.6897
50 : USD 1.6783
100 : USD 1.5989
500 : USD 1.5763
1000 : USD 1.5082
5000 : USD 1.4515
N/A

Obsolete

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
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Additional Infomation About Product

W25Q128FW 1.8V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: May 18, 2017 Revision K W25Q128FW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil ............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 3.8 Ball Configuration WLCSP ................................................................................................... 9 3.9 Ball Description WLCSP ....................................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Select (/CS) ................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 10 4.3 Write Protect (/WP) ............................................................................................................ 10 4.4 HOLD (/HOLD) ................................................................................................................... 10 4.5 Serial Clock (CLK) .............................................................................................................. 10 4.6 Reset (/RESET) .................................................................................................................. 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 SPI / QPI Operations .......................................................................................................... 12 6.1.1 Standard SPI Instructions ..................................................................................................... 12 6.1.2 Dual SPI Instructions ............................................................................................................ 12 6.1.3 Quad SPI Instructions ........................................................................................................... 13 6.1.4 QPI Instructions .................................................................................................................... 13 6.1.5 Hold Function ....................................................................................................................... 13 6.1.6 Software Reset & Hardware /RESET pin .............................................................................. 14 6.2 Write Protection .................................................................................................................. 15 6.2.1 Write Protect Features ......................................................................................................... 15 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 16 7.1 Status Registers ................................................................................................................. 16 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 16 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 16 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 16 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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