Product Information

W25Q128JVSIM TR

W25Q128JVSIM TR electronic component of Winbond

Datasheet
NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector, DTR
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.8354 ea
Line Total: USD 1.84

23980 - Global Stock
Ships to you between
Mon. 20 May to Wed. 22 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
11640 - WHS 1


Ships to you between Tue. 14 May to Mon. 20 May

MOQ : 2000
Multiples : 2000
2000 : USD 1.5104
4000 : USD 1.5104
6000 : USD 1.5104

999 - WHS 2


Ships to you between Tue. 14 May to Mon. 20 May

MOQ : 1
Multiples : 1
1 : USD 1.7015
10 : USD 1.6832
25 : USD 1.6589
100 : USD 1.6345
250 : USD 1.6018
500 : USD 1.6018
1000 : USD 1.6018

23980 - WHS 3


Ships to you between Mon. 20 May to Wed. 22 May

MOQ : 1
Multiples : 1
1 : USD 1.8354
10 : USD 1.6663
100 : USD 1.5094
500 : USD 1.4852
1000 : USD 1.4369
2000 : USD 1.3645
4000 : USD 1.3403
10000 : USD 1.3282
24000 : USD 1.3282

999 - WHS 4


Ships to you between Tue. 14 May to Mon. 20 May

MOQ : 6
Multiples : 1
6 : USD 1.7015
10 : USD 1.6832
25 : USD 1.6304
100 : USD 1.467
250 : USD 1.4376

11640 - WHS 5


Ships to you between Tue. 14 May to Mon. 20 May

MOQ : 2000
Multiples : 2000
2000 : USD 1.6624

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
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Additional Infomation About Product

W25Q128JV-DTR 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI & DTR For Industrial & Industrial Plus Grade Publication Release Date: March 02, 2018 -Revision C W25Q128JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil ............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 SPI / QPI DTR Read Instructions ......................................................................................... 12 6.1.6 Hold Function ....................................................................................................................... 12 6.1.7 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 6.2.1 Write Protect Features ......................................................................................................... 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 15 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 15 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 15

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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