Product Information

W25Q64JVZEIQ

W25Q64JVZEIQ electronic component of Winbond

Datasheet
NOR Flash spiFlash, 64M-bit, DTR, 4Kb Uniform Sector

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.8367 ea
Line Total: USD 0.84

2100 - Global Stock
Ships to you between
Fri. 31 May to Wed. 05 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
637 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

W25Q64JVZEIQ
Winbond

1 : USD 0.9889
10 : USD 0.9792
504 : USD 0.9755
1008 : USD 0.971
2520 : USD 0.9516
5040 : USD 0.9516
10017 : USD 0.9516

465 - WHS 2


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

W25Q64JVZEIQ
Winbond

1 : USD 1.0126
10 : USD 1.0042
504 : USD 1.0019
1008 : USD 0.9819
2520 : USD 0.9819
5040 : USD 0.9819

2100 - WHS 3


Ships to you between
Fri. 31 May to Wed. 05 Jun

MOQ : 1
Multiples : 1

Stock Image

W25Q64JVZEIQ
Winbond

1 : USD 0.8109
10 : USD 0.6792
30 : USD 0.6133
100 : USD 0.564
500 : USD 0.5245
1000 : USD 0.5047

22 - WHS 4


Ships to you between
Fri. 31 May to Wed. 05 Jun

MOQ : 1
Multiples : 1

Stock Image

W25Q64JVZEIQ
Winbond

1 : USD 3.6921
10 : USD 3.1994
30 : USD 2.8928
100 : USD 2.5756
480 : USD 2.434
960 : USD 2.3726

301 - WHS 5


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

W25Q64JVZEIQ
Winbond

1 : USD 1.206
10 : USD 1.1948
504 : USD 1.0889
1008 : USD 1.054
2520 : USD 1.0291
5040 : USD 1.0204
10017 : USD 1.0091
25011 : USD 0.9979

     
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RoHS - XON
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W25Q64JV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: March 27, 2018 Revision J W25Q64JV Table of Contents 1. GENERAL DESCRIPTIONS .................................................................................................................. 4 2. FEATURES ............................................................................................................................................ 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ............................................................................... 5 3.1 Pin Configuration SOIC 208-mil ................................................................................................ 5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm .................................................. 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm ............................... 5 3.4 Pin Configuration SOIC 300-mil ................................................................................................ 6 3.5 Pin Description SOIC 300-mil .................................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ...................................................... 7 3.7 Ball Description TFBGA 5x5 or 8x6-mm ................................................................................... 7 3.8 Ball Configuration WLCSP ........................................................................................................ 8 3.9 Ball Description WLCSP12 ........................................................................................................ 8 4. PIN DESCRIPTIONS ............................................................................................................................. 9 4.1 Chip Select (/CS) ....................................................................................................................... 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ......................................... 9 4.3 Write Protect (/WP) .................................................................................................................... 9 4.4 HOLD (/HOLD) .......................................................................................................................... 9 4.5 Serial Clock (CLK) ..................................................................................................................... 9 (1) 4.6 Reset (/RESET) ...................................................................................................................... 9 5. BLOCK DIAGRAM ............................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS .......................................................................................................... 11 6.1 Standard SPI Instructions ........................................................................................................ 11 6.2 Dual SPI Instructions ............................................................................................................... 11 6.3 Quad SPI Instructions.............................................................................................................. 11 6.4 Software Reset & Hardware /RESET pin ................................................................................ 11 6.5 Write Protection ....................................................................................................................... 12 Write Protect Features ............................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ................................................................................. 13 7.1 Status Registers ...................................................................................................................... 13 Erase/Write In Progress (BUSY) Status Only ...................................................................... 13 Write Enable Latch (WEL) Status Only ................................................................................ 13 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ...................................... 13 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ............................................. 14 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ............................................. 14 Complement Protect (CMP) Volatile/Non-Volatile Writable ................................................. 14 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ..................................... 15 Erase/Program Suspend Status (SUS) Status Only ............................................................ 16 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ................ 16 Quad Enable (QE) Volatile/Non-Volatile Writable ................................................................ 16 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ............................................. 17 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ................................. 17 Publication Release Date: March 27, 2018 - 1 - Revision J

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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