TLP5702(TP,E

TLP5702 Photocouplers GaAAs Infrared LED & Photo IC TLP5702TLP5702TLP5702TLP5702 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Induction Cooktop and Home Appliances Industrial Inverters Air Conditioner Inverters MOSFET Gate Drivers IGBT Gate Drivers 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP5702 is a photocoupler in a 6-pin SO6L package that consists of a GaAAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperature up to 110 . The TLP5702 is physically smaller / thinner than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. An internal noise shield provides a guaranteed common-mode transient immunity of 20 kV/s. The TLP5702 is ideal for small to medium class IGBT and power MOSFET gate drive. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 2.5 A (max) (3) Operating temperature: -40 to 110 (4) Supply current: 3.0 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: t /t = 200 ns (max) pHL pLH (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2014-01 2015-2018 2018-01-10 1 Toshiba Electronic Devices & Storage Corporation Rev.5.0TLP5702 4. 4. 4. 4. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP5702 TLP5702(LF4) 11-4N1A 11-4N101A Note: Lead-formed product: (LF4) 5. Pin Assignment 5. 5. 5. Pin AssignmentPin AssignmentPin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 6. 6. 6. 6. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 2015-2018 2018-01-10 2 Toshiba Electronic Devices & Storage Corporation Rev.5.0