TLP5752(D4-TP,E

TLP5752 Photocouplers GaAAs Infrared LED & Photo IC TLP5752TLP5752TLP5752TLP5752 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Induction Cooktop and Home Appliances Transistor Inverters Air Conditioner Inverters MOSFET Gate Drivers IGBT Gate Drivers 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP5752 consists of a GaAAs infrared light-emitting diode and integrated high-gain, high-speed photodetector and is house in the 6-pin SO6L package. The TLP5752 is 50 % smaller than the 8-pin DIP package and meets the reinforced insulation class requirements of international safety standards. Therefore the mounting area can be reduced in equipment requiring the safety standard certification. The TLP5752 has an internal faraday shield that provides a guaranteed common-mode transient immunity of 35 kV/s. In particular, the TLP5752 has rail to rail output, and this enables stable operation and better switching performance in system. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 2.5 A (max) (3) Operating temperature: -40 to 110 (4) Supply current: 3 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 4 mA (max) (7) Propagation delay time: t /t = 150 ns (max) pHL pLH (8) Common-mode transient immunity: 35 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065 or EN60950-1, EN62368-1 (Pending) (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2014-06 2015 Toshiba Corporation 2015-11-12 1 Rev.2.0TLP5752 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-4N1A 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Size Unit Height 2.3 (max) mm Creepage distances 8.0 (min) Clearance distances 8.0 (min) Internal isolation thickness 0.4 (min) 2015 Toshiba Corporation 2015-11-12 2 Rev.2.0