Product Information

BGA2717,115

BGA2717,115 electronic component of NXP

Datasheet
RF Amplifier TAPE-7 MMIC-RFSS

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.1376 ea
Line Total: USD 0.14

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1
1 : USD 0.1376
5 : USD 0.134
500 : USD 0.1243
2500 : USD 0.1219

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Maximum Operating Temperature
Operating Supply Current
Packaging
Test Frequency
Brand
Factory Pack Quantity :
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BGA2717 MMIC wideband amplifier Rev. 3 8 September 2011 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Internally matched to 50 Wide frequency range (3.2 GHz at 3 dB bandwidth) Flat 24 dB gain (1 dB up to 2.8 GHz) 2.5 dBm output power at 1 dB compression point Good linearity for low current (IP3 = 10 dBm) out Low second harmonic 38 dBc at P = 40 dBm D Low noise figure 2.3 dB at 1 GHz Unconditionally stable (K 2). 1.3 Applications LNB IF amplifiers Cable systems ISM General purpose. 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V DC supply voltage - 5 6 V S I supply current - 8 - mA S 2 s insertion power gain f = 1 GHz - 24 - dB 21 NF noise figure f = 1 GHz - 2.3 - dB P saturated load power f = 1 GHz - 1 - dBm L(sat)BGA2717 NXP Semiconductors MMIC wideband amplifier 2. Pinning information Table 2. Pinning Pin Description Simplified outline Symbol 1V S 6 5 4 1 2, 5 GND2 3RF OUT 6 3 4 GND1 4 2, 5 132 6RF IN sym052 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGA2717 - plastic surface mounted package 6 leads SOT363 4. Marking Table 4. Marking Type number Marking code BGA2717 1B- 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V DC supply voltage RF input AC -6 V S coupled I supply current - 15 mA S P total power dissipation T 90 C- 200mW tot sp T storage temperature 65 +150 C stg T junction temperature - 150 C j P maximum drive power - 10 dBm D BGA2717 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 8 September 2011 2 of 15

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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