Product Information

A3I35D025WNR1

A3I35D025WNR1 electronic component of NXP

Datasheet
RF Amplifier LDMOS Wdbnd Pwr Amp 3200-4000 MH 3.4W28V

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

500: USD 33.66 ea
Line Total: USD 16830

0 - Global Stock
MOQ: 500  Multiples: 500
Pack Size: 500
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Tue. 21 May

MOQ : 500
Multiples : 500
500 : USD 42.8835
1000 : USD 42.8835
2500 : USD 42.803

     
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RoHS - XON
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Operating Supply Voltage
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Operating Supply Current
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Moisture Sensitive
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DocumentNumber:A3I35D025WN NXPSemiconductors Rev. 0, 06/2018 Technical Data RFLDMOSWidebandIntegrated A3I35D025WNR1 PowerAmplifiers A3I35D025WGNR1 The A3I35D025WN wideband integrated circuit is designed for cellular base station applications requiring very wide instantaneous bandwidth capability. This circuit includes on--chip matching that makes it usable from 3200 to 4000 32004000MHz,3.4WAVG.,28V MHz. Its multi--stage structure is rated for 20 to 32 V operation and covers all AIRFASTRFLDMOSWIDEBAND typical cellular basestationmodulationformats. INTEGRATEDPOWERAMPLIFIERS 3500MHz Typical Single--Carrier W--CDMA CharacterizationPerformance: V =28Vdc,I =72mA,I = 260 mA, P = 3.4W Avg., DD DQ1(A+B) DQ2(A+B) out (1) Input Signal PAR = 9.9 dB 0.01%Probability onCCDF. G PAE ACPR TO--270WB--17 ps Frequency (dB) (%) (dBc) PLASTIC A3I35D025WN 3400 MHz 28.5 16.5 46.5 3500 MHz 28.8 17.0 46.3 3600 MHz 28.9 17.3 46.1 TO--270WBG--17 3700 MHz 28.7 17.7 46.4 PLASTIC 3800 MHz 28.5 17.9 46.2 A3I35D025WGN Features Designed for wide instantaneous bandwidth applications On--chipmatching(50ohm input, DC blocked) Integratedquiescent current temperaturecompensationwith (2) enable/disable function Designedfor digital predistortionerror correctionsystems Optimizedfor Doherty applications 1. Alldata measured in fixture with device soldered to heatsink. 2. RefertoAN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family,andtoAN1987, Quiescent Current Control for the RF Integrated Circuit Device Family.GotoV DS1A VBW 1 17 A (4) V VBW DS1A A V 2 GS2A RF RF /V V 3 16 inA out1 DS2A GS1A RF /V out1 DS2A RF 4 inA N.C. 5 N.C. 6 (2) (3) V N.C. GS1A 15 QuiescentCurrent N.C. 7 (1) V TemperatureCompensation GS2A N.C. 8 RF 14 9 inB RF /V V out2 DS2B GS1B V 10 GS1B QuiescentCurrent V 11 (1) GS2B V TemperatureCompensation GS2B 13 (4) V VBW DS1B B 12 (Top View) RF RF /V inB out2 DS2B Note: Exposed backside of the package is V VBW DS1B the source terminalforthe transistor. B Figure1.FunctionalBlockDiagram Figure2.PinConnections 1. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated 2. Pinconnections1and12areDCcoupled CircuitFamily,andtoAN1987,QuiescentCurrentControlfortheRFIntegratedCircuit and RF independent. Device Family.Goto

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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