Product Information

W25Q32FWSSIG

W25Q32FWSSIG electronic component of Winbond

Datasheet
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 32M-bit 4M x 8 6ns
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

11: USD 1.0954 ea
Line Total: USD 12.05

0 - Global Stock
MOQ: 11  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 1
Multiples : 1

Stock Image

W25Q32FWSSIG
Winbond

1 : USD 0.8639

0 - WHS 2


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 11
Multiples : 1

Stock Image

W25Q32FWSSIG
Winbond

11 : USD 1.0954
25 : USD 1.0747

Read More Specifications

     
Manufacturer
Product Category
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Address Bus
Program/Erase Volt Typ
Programmable
Density
Operating Supply Voltage Typ
Operating Temp Range
Rad Hardened
Operating Temperature Classification
Access Time Max
Boot Type
Cell Type
LoadingGif

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Additional Infomation About Product

W25Q32FW 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: April 24, 2018 - Revision J W25Q32FW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm ............................................ 5 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm, XSON 4x4-mm ............ 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7 3.8 Ball Configuration WLCSP ................................................................................................... 8 3.9 Ball Description WLCSP12 ................................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP) ............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 Hold Function ........................................................................................................................ 12 6.1.6 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................. 15 7.1.2 Write Enable Latch (WEL) Status Only ........................................................................... 15 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 15 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 16 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 16 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 16 7.1.7 Status Register Protect (SRP1, SRP0) Volatile/Non-Volatile Writable............................ 16 7.1.8 Erase/Program Suspend Status (SUS) Status Only ....................................................... 17 7.1.9 Security Register Lock Bits (LB 3:1 ) Volatile/Non-Volatile OTP Writable....................... 17 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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