Product Information

TLP3823(LF5,F

TLP3823(LF5,F electronic component of Toshiba

Datasheet
MOSFET Output Optocouplers Photorelay 3A 100V 2500Vrms 720pF

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.7887 ea
Line Total: USD 10.79

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Tue. 21 May

MOQ : 1
Multiples : 1
1 : USD 10.7887
10 : USD 8.4348
25 : USD 7.1712
50 : USD 5.9184
100 : USD 5.2704
250 : USD 5.0436

     
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TLP3823,TLP3823F Photocouplers Photorelay TLP3823,TLP3823FTLP3823,TLP3823FTLP3823,TLP3823FTLP3823,TLP3823F 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Mechanical relay replacements Factory Automation (FA) Programmable Logic Controllers (PLCs) Security Systems Measuring Instruments ATE (Automatic Test Equipment) 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP3823 and TLP3823F photorelay consist of a photo MOSFET optically coupled to an infrared LED. It is housed in a 8-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3823 and TLP3823F make it suitable for power line control applications. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 100 V (min) (3) Trigger LED current: 5.0 mA (max) (4) ON-state current: 3 A (max) (A connection) (5) ON-state resistance: 150 m (max) (A connection) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 4. 4. 4. 4. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62-mm Pitch 10.16-mm Pitch Characteristics Unit TLP3823 TLP3823F Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Start of commercial production 2017-03 2016-2020 2020-03-23 1 Toshiba Electronic Devices & Storage Corporation Rev.5.0TLP3823,TLP3823F 5. 5. 5. 5. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP3823 TLP3823(LF1,TP1) TLP3823(LF5,TP5) 11-10C405S 11-10C4S 11-10C401S TLP3823F TLP3823F(LF4,TP4) 11-10C404S 11-10C402S Note: Through-hole type: TLP3823, TLP3823F Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. 6. Pin AssignmentPin Assignment 6. 6. Pin AssignmentPin Assignment 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: Drain 6: Source 7: Source 8: Drain 2016-2020 2020-03-23 2 Toshiba Electronic Devices & Storage Corporation Rev.5.0

Tariff Desc

8541.50.00 - Other semiconductor devices (not IC) semiconductor devices
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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