IIS3DWB Datasheet Ultra-wide bandwidth, low-noise, 3-axis digital vibration sensor Features 3-axis vibration sensor with digital output LGA-14L User-selectable full-scale: 2/4/8/16 g (2.5 x 3.0 x 0.83 mm) typ. Ultra-wide and flat frequency response range: from dc to 6 kHz (3 dB point) Ultra-low noise density: down to 75 g/Hz in 3-axis mode / 60 g/Hz in single- axis mode High stability of the sensitivity over temperature and against mechanical shocks Extended temperature range from -40 to +105 C Low power: 1.1 mA with all 3 axes delivering full performance SPI serial interface Low-pass or high-pass filter with selectable cut-off frequency Interrupts for wake-up / activity - inactivity / FIFO thresholds Embedded FIFO: 3 kB Embedded temperature sensor Embedded self-test Supply voltage: 2.1 V to 3.6 V Compact package: LGA 2.5 x 3 x 0.83 mm 14-lead ECOPACK, RoHS and Green compliant Applications Product status link IIS3DWB Vibration monitoring Condition monitoring Product summary Predictive maintenance Order code IIS3DWBTR IIS3DWB Test and measurements Temp. -40 to +105 range C Description Package LGA-14 The IIS3DWB is a system-in-package featuring a 3-axis digital vibration sensor with Tape and Packing Tray low noise over an ultra-wide and flat frequency range. The wide bandwidth, low reel noise, very stable and repeatable sensitivity, together with the capability of operating over an extended temperature range (up to +105 C), make the device particularly Product labels suitable for vibration monitoring in industrial applications. The high performance delivered at low power consumption together with the digital output and the embedded digital features like the FIFO and the interrupts are enabling features for battery-operated industrial wireless sensor nodes. The IIS3DWB has a selectable full-scale acceleration range of 2/4/8/16 g and is capable of measuring accelerations with a bandwidth up to 6 kHz with an output data rate of 26.7 kHz. A 3 kB first-in, first-out (FIFO) buffer is integrated in the device to avoid any data loss and to limit intervention of the host processor. DS12569 - Rev 6 - August 2020 www.st.com For further information contact your local STMicroelectronics sales office.IIS3DWB The MEMS sensor module family from ST leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve automotive, industrial and consumer markets. The sensing elements are manufactured using STs proprietary micromachining process, while the embedded IC interfaces are developed using CMOS technology. The IIS3DWB has a self-test capability which allows checking the functioning of the sensor in the final application. The IIS3DWB is available in a 14-lead plastic land grid array (LGA) package and is guaranteed to operate over an extended temperature range from -40 C to +105 C. DS12569 - Rev 6 page 2/59