Product Information

NUF6001MUT2G

NUF6001MUT2G electronic component of ON Semiconductor

Datasheet
ON Semiconductor EMI Network Filter Arrays EMI Filter 6 Line ESD

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

110: USD 0.075 ea
Line Total: USD 8.25

226 - Global Stock
Ships to you between
Tue. 21 May to Mon. 27 May
MOQ: 110  Multiples: 1
Pack Size: 1
Availability Price Quantity
226 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 1
Multiples : 1

Stock Image

NUF6001MUT2G
ON Semiconductor

1 : USD 0.0779
10 : USD 0.0765
25 : USD 0.075
50 : USD 0.075
100 : USD 0.075

226 - WHS 2


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 110
Multiples : 1

Stock Image

NUF6001MUT2G
ON Semiconductor

110 : USD 0.075

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Product Type
Vesd - Voltage ESD Contact
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Cd - Diode Capacitance
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Pd - Power Dissipation
Subcategory
Taric
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NUF6001MU 6-Channel EMI Filter with Integrated ESD Protection The NUF6001MU is a sixchannel (CRC) Pistyle EMI filter array with integrated ESD protection. Its typical component values of R = 100 and C = 17 pF deliver a cutoff frequency of 120 MHz and www.onsemi.com stop band attenuation greater than 30 dB from 800 MHz to 3.0 GHz. This performance makes the part ideal for parallel interfaces with data rates up to 80 Mbps in applications where wireless interference MARKING 12 DIAGRAM must be minimized. The specified attenuation range is very effective in minimizing interference from 2G/3G, GPS, Bluetooth and 601M 1 WLAN signals. UDFN12 The NUF6001MU is available in the lowprofile 12lead MU SUFFIX 1 1.2x2.5mm UDFN12 surface mount package. CASE 517AE 601 = Specific Device Code Features/Benefits M = Month Code 18 kV ESD Protection on each channel (IEC6100042 Level 4, = PbFree Package Contact Discharge) (Note: Microdot may be in either location) 16 kV ESD Protection on each channel (HBM) R/C Values of 100 and 17 pF deliver Exceptional S21 Performance Characteristics of 120 MHz f and 30 dB Stop Band Attenuation ORDERING INFORMATION 3dB from 800 MHz to 3.0 GHz Device Package Shipping Integrated EMI/ESD System Solution in UDFN Package Offers NUF6001MUT2G UDFN12 3000 / Tape & Reel Exceptional Cost, System Reliability and Space Savings (PbFree) These Devices are PbFree, Halogen Free/BFR Free and are RoHS For information on tape and reel specifications, Compliant including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Applications Brochure, BRD8011/D. EMI Filtering for LCD and Camera Data Lines EMI Filtering and Protection for I/O Ports and Keypads 0 10 20 R=100 Filter + ESD Filter + ESD n n 30 C = 17 pF C = 17 pF d d 40 See Table 1 for pin description 50 60 1.0E+6 10E+6 100E+6 1.0E+9 10E+9 FREQUENCY (Hz) Figure 1. Electrical Schematic Figure 2. Typical Insertion Loss Curve Semiconductor Components Industries, LLC, 2009 1 Publication Order Number: March, 2018 Rev. 5 NUF6001MU/D S21 (dB)NUF6001MU 12 3 4 5 6 GND PAD 12 11 10 9 8 7 (Bottom View) Figure 3. Pin Diagram Table 1. FUNCTIONAL PIN DESCRIPTION Filter Device Pins Description Filter 1 1 & 12 Filter + ESD Channel 1 Filter 2 2 & 11 Filter + ESD Channel 2 Filter 3 3 & 10 Filter + ESD Channel 3 Filter 4 4 & 9 Filter + ESD Channel 4 Filter 5 5 & 8 Filter + ESD Channel 5 Filter 6 6 & 7 Filter + ESD Channel 6 Ground Pad GND Ground MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit ESD IEC6100042 (Contact Discharge) 18 kV Human Body Model 16 Machine Model 1.6 DC Power per Resistor P 100 mW R DC Power per Package P 600 mW T Operating Temperature Range T 40 to 85 C OP Storage Temperature Range T 55 to 150 C STG Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) T 260 C L Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Conditions Min Typ Max Unit Maximum Reverse Working Voltage V 5.0 V RWM Breakdown Voltage V I = 1.0 mA 6.0 7.0 8.0 V BR R Leakage Current I V = 3.3 V 10 100 nA R RWM Resistance R I = 20 mA 85 100 115 A R Diode Capacitance C V = 2.5 V, f = 1.0 MHz 17 22 pF d R Line Capacitance C V = 2.5 V, f = 1.0 MHz 34 44 pF L R 3 dB CutOff Frequency (Note 1) f Above this frequency, 120 MHz 3dB appreciable attenuation occurs 6 dB CutOff Frequency (Note 1) f Above this frequency, 185 MHz 3dB appreciable attenuation occurs Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. 50 source and 50 load termination. www.onsemi.com 2

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
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