Product Information

NTD6415ANLT4G

NTD6415ANLT4G electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET 100V HD3E NCH

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.9459 ea
Line Total: USD 1.95

1644 - Global Stock
Ships to you between
Fri. 31 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1644 - WHS 1


Ships to you between Fri. 31 May to Tue. 04 Jun

MOQ : 1
Multiples : 1

Stock Image

NTD6415ANLT4G
ON Semiconductor

1 : USD 1.9459
10 : USD 1.6492
100 : USD 1.3645
250 : USD 1.3289
500 : USD 1.1699
1000 : USD 1.0145
2500 : USD 1.0026
5000 : USD 0.9966

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Configuration
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Category
Brand Category
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MOSFET Power, N-Channel, Logic Level 100 V, 23 A, 56 m NTD6415ANL, NVD6415ANL Features Low R DS(on) www.onsemi.com 100% Avalanche Tested NVD Prefix for Automotive and Other Applications Requiring V R MAX I MAX (BR)DSS DS(on) D Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable 56 m 4.5 V 100 V 23 A These Devices are PbFree and are RoHS Compliant 52 m 10 V MAXIMUM RATINGS (T = 25C unless otherwise noted) J D Parameter Symbol Value Unit DraintoSource Voltage V 100 V DSS GatetoSource Voltage Continuous V 20 V GS G Continuous Drain Steady T = 25C I 23 A D C Current State T = 100C 16 C S Power Dissipation Steady T = 25C P 83 W C D State 4 Pulsed Drain Current t = 10 s I 80 A p DM 2 1 Operating and Storage Temperature Range T , T 55 to C J stg 3 +175 DPAK Source Current (Body Diode) I 23 A CASE 369AA S STYLE 2 Single Pulse DraintoSource Avalanche E 79 mJ AS Energy (V = 50 Vdc, V = 10 Vdc, I = DD GS L(pk) 23 A, L = 0.3 mH, R = 25 ) G MARKING DIAGRAM Lead Temperature for Soldering T 260 C & PIN ASSIGNMENT L Purposes, 1/8 from Case for 10 Seconds 4 Drain THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit JunctiontoCase (Drain) Steady State R 1.8 C/W JC 1 3 JunctiontoAmbient Steady State (Note 1) R 49 JA 2 Gate Source Stresses exceeding those listed in the Maximum Ratings table may damage the Drain device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. A = Assembly Location* 1. Surface mounted on FR4 board using 1 sq in pad size, 6415ANL = Device Code (Cu Area 1.127 sq in 2 oz including traces). Y = Year WW = Work Week G = PbFree Package * The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: March, 2020 Rev. 6 NTD6415ANL/D AYWW 64 15ANLGNTD6415ANL, NVD6415ANL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 100 V (BR)DSS GS D V = 0 V, I = 250 A, T = 40C 92 GS D J DraintoSource Breakdown Voltage V /T 115 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, GS V = 100 V DS T = 125C 100 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 2) Gate Threshold Voltage V 1.0 2.0 V V = V , I = 250 A GS(TH) GS DS D Negative Threshold Temperature V /T 4.8 mV/C GS(TH) J Coefficient DraintoSource OnResistance R V = 4.5 V, I = 10 A 44 56 m DS(on) GS D V = 10 V, I = 10 A 43 52 GS D Forward Transconductance g V = 5.0 V, I = 10 A 24 S FS DS D CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance C 1024 pF ISS Output Capacitance C V = 0 V, f = 1.0 MHz, V = 25 V 156 OSS GS DS Reverse Transfer Capacitance C 70 RSS nC Total Gate Charge Q 20 G(TOT) Threshold Gate Charge Q 1.1 G(TH) V = 4.5 V, V = 80 V, I = 23 A GS DS D GatetoSource Charge Q 3.1 GS GatetoDrain Charge Q 14 GD Total Gate Charge Q V = 10 V, V = 80 V, I = 23 A 35 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 3) TurnOn Delay Time t 11 ns d(on) Rise Time t 91 r V = 4.5 V, V = 80 V, GS DD I = 23 A, R = 6.1 TurnOff Delay Time t D G 40 d(off) Fall Time t 71 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.87 1.2 V SD J V = 0 V, I = 23 A GS S T = 125C 0.74 J Reverse Recovery Time t 64 ns RR Charge Time T 40 a V = 0 V, dI /dt = 100 A/ s, GS S I = 23 A S Discharge Time T 24 b Reverse Recovery Charge Q 152 nC RR 2. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 3. Switching characteristics are independent of operating junction temperatures. ORDERING INFORMATION Device Package Shipping NTD6415ANLT4G DPAK NVD6415ANLT4G 2500 / Tape & Reel (PbFree) NVD6415ANLT4GVF01 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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