Product Information

NCP103AMX090TCG

NCP103AMX090TCG electronic component of ON Semiconductor

Datasheet
LDO Voltage Regulators 150 MA CMOS LDO AD O

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 9000
Multiples : 3000

Stock Image

NCP103AMX090TCG
ON Semiconductor

9000 : USD 0.0898
12000 : USD 0.0841
15000 : USD 0.0833
18000 : USD 0.0825
24000 : USD 0.0818
30000 : USD 0.0809
45000 : USD 0.08
48000 : USD 0.0793
60000 : USD 0.0783
N/A

Obsolete
0 - WHS 2

MOQ : 9000
Multiples : 3000

Stock Image

NCP103AMX090TCG
ON Semiconductor

9000 : USD 0.0479
N/A

Obsolete
0 - WHS 3

MOQ : 1
Multiples : 1

Stock Image

NCP103AMX090TCG
ON Semiconductor

1 : USD 1.2312
10 : USD 0.9288
100 : USD 0.1858
500 : USD 0.1393
1000 : USD 0.1102
3000 : USD 0.0875
9000 : USD 0.0788
24000 : USD 0.0756
45000 : USD 0.0735
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
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DATA SHEET www.onsemi.com Low Dropout Regulator - CMOS 1 UDFN4 150 mA MX SUFFIX CASE 517CU NCP103 MARKING DIAGRAM The NCP103 is 150 mA LDO that provides the engineer with a very stable, accurate voltage with low noise suitable for space constrained, noise sensitive applications. In order to optimize performance for XX M battery operated portable applications, the NCP103 employs the 1 dynamic quiescent current adjustment for very low I consumption at Q XX = Specific Device Code noload. M = Date Code Features Operating Input Voltage Range: 1.7 V to 5.5 V PIN CONNECTION Available in Fixed Voltage Options: 0.9 V to 3.5 V EN IN Contact Factory for Other Voltage Options 34 Very Low Quiescent Current of Typ. 50 A Standby Current Consumption: Typ. 0.1 A Low Dropout: 75 mV Typical at 150 mA 1% Accuracy at Room Temperature High Power Supply Ripple Rejection: 75 dB at 1 kHz 2 1 Thermal Shutdown and Current Limit Protections GND OUT Stable with a 1 F Ceramic Output Capacitor (Bottom View) Available in uDFN 1.0 x 1.0 mm Package These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant ORDERING INFORMATION See detailed ordering, marking and shipping information on Typical Applicaitons page 13 of this data sheet. PDAs, Mobile phones, GPS, Smartphones Wireless Handsets, Wireless LAN, Bluetooth , Zigbee Portable Medical Equipment Other Battery Powered Applications V IN V OUT IN OUT NCP103 C C IN OUT EN 1 F ON GND Ceramic OFF Figure 1. Typical Application Schematic Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: October, 2021 Rev. 14 NCP103/DNCP103 IN ENABLE THERMAL EN LOGIC SHUTDOWN BANDGAP MOSFET REFERENCE DRIVER WITH CURRENT LIMIT OUT AUTO LOW POWER MODE ACTIVE DISCHARGE* EN GND *Active output discharge function is present only in NCP103AMXyyyTCG devices. yyy denotes the particular V option. OUT Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 F is needed from this pin to ground to assure stability. 2 GND Power supply ground. 3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 4 IN Input pin. A small capacitor is needed from this pin to ground to assure stability. EPAD Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows for effective heat removal. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) V 0.3 V to 6 V V IN Output Voltage VOUT 0.3 V to VIN + 0.3 V or 6 V V Enable Input VEN 0.3 V to VIN + 0.3 V or 6 V V Output Short Circuit Duration tSC s Maximum Junction Temperature T 150 C J(MAX) Storage Temperature T 55 to 150 C STG ESD Capability, Human Body Model (Note 2) ESD 2000 V HBM ESD Capability, Machine Model (Note 2) ESD 200 V MM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22A114, ESD Machine Model tested per EIA/JESD22 A115, Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS (Note 3) Rating Symbol Value Unit Thermal Characteristics, uDFN4 1x1 mm 170 C/W R JA Thermal Resistance, JunctiontoAir 2 3. Single component mounted on 1 oz, FR 4 PCB with 645 mm Cu area. www.onsemi.com 2

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Aptina / ON Semiconductor
FAIRCHILD
FAIRCHILD (ON SEMICONDUCTOR)
Fairchild Semiconductor
FS8
FSC
ON
ON SEMI
ON Semicon
ON SEMICONDUCTOR
ON SEMICONDUCTOR (FAIRCHILD)
ON Semiconductor / Fairchild
ON4
ON5
onsemi
ON-SEMI
onsemi / Fairchild
OOF
Xsens / Fairchild

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