MC33SA0528AC

NXP Semiconductors Document Number: MC33SA0528 Rev. 3.0, 7/2016 Data sheet: Advance Information Dual DSI master transceiver 33SA0528 The 33SA0528 is a third generation SMARTMOS standalone, dual-channel distributed system interface (DSI) master device. Each of the two independent channels contain a differential driver and a dual adder receiver. The embedded DSI protocol engine converts the DSI data Automotive restraint system between the physical interface and the two redundant SPI interfaces. The MCU can control and configure the 33SA0528 and extract all of the slaves transceivers data from it via the dual SPI. To ensure the communication reliability, the 33SA0528 uses an on-chip band gap reference regulator to monitor all of the supply voltages, and uses an on- chip oscillator to monitor the PLL clock for the external clock error detection. Features AC SUFFIX (PB-FREE) Two independent DSI master channels 98ASH70029A Supports command and response mode for slave configuration 32-PIN LQFP Supports periodic data collection mode (PDCM) for periodic slave data Applications transfers Automotive airbag and safety Supports discovery mode for slave physical address self-programming Industrial systems 10 MHz 32-bit dual SPI: main SPI for device configuration and DSI operation, and redundant SPI for safety purposes Sense and trigger applications Point-to-point, parallel, daisy chain bus topologies Various diagnostic features V V CC5 DSI MCU 33SA0528 VDSI V2P5A VCC5 V2P5D GNDA DSI Slaves Interfaces GNDD GPIO RSTB SPI0 SCK SCK0 DH0 SPI0 CS CS0B D SPI0 MOSI MOSI0 DL0 SPI0 MISO MISO0 GNDP DSI0 SPI1 SCK SCK1 GNDP DSI1 SPI1 CS CS1B MOSI1 SPI1 MOSI DH1 SPI1 MISO MISO1 DL1 CLKOUT CLK IN CLK OUT CLK GNDSUB Figure 1. 33SA0528 simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. 2016 NXP B.V.Table of Contents 1 Orderable parts 3 2 Internal block diagram . 4 3 Pin connections 5 3.1 Pinout diagram . 5 3.2 Pin definitions 5 4 General product characteristics 7 4.1 Maximum ratings . 7 4.2 Thermal characteristics 7 4.3 Operating conditions . 8 4.4 Supply currents . 8 5 General IC functional description . 9 5.1 Block diagram 9 5.2 Features 9 5.3 Functional description 9 5.4 Communication . 9 6 Functional block description . 10 6.1 SPI . 10 6.2 DSI protocol engine 20 6.4 Power supply monitor . 30 6.5 Clock and reset module . 31 7 Typical applications 33 7.1 Introduction . 33 7.2 Application diagram 33 7.3 Layout recommendations 34 8 Packaging . 35 8.1 Package mechanical dimensions 35 9 Revision history . 39 33SA0528 NXP Semiconductors 2