Product Information

MC33PF8201A0ES

MC33PF8201A0ES electronic component of NXP

Datasheet
Power Management Specialised - PMIC Power Management IC, i.MX8, non-prog, 5 buck, 3 LDO, ASIL-B, Auto, QFN 56

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 15.1677 ea
Line Total: USD 15.17

135 - Global Stock
Ships to you between
Tue. 21 May to Thu. 23 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
135 - WHS 1


Ships to you between Tue. 21 May to Thu. 23 May

MOQ : 1
Multiples : 1
1 : USD 10.2275
10 : USD 9.6721
25 : USD 8.6336
100 : USD 8.5974
260 : USD 8.2473
520 : USD 7.9816

     
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RoHS - XON
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Moisture Sensitive
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PF8101 PF8201 9-channel power management integrated circuit for high performance applications Rev. 4 24 February 2021 Product data sheet 1 Overview The PF8101/PF8201 is a power management integrated circuit (PMIC) designed for high performance i.MX 8 based applications. It features five high efficiency buck converters and three linear regulators for powering the processor, memory and miscellaneous peripherals. Built-in one time programmable memory stores key startup configurations, drastically reducing external components typically used to set output voltage and sequence of 2 external regulators. Regulator parameters are adjustable through high-speed I C after start up offering flexibility for different system states. 2 Features Up to five high efficiency buck converters Three linear regulators with load switch options RTC supply and coin cell charger Watchdog timer/monitor Monitoring circuit to fit ASIL B safety level One time programmable device configuration 2 3.4 MHz I C communication interface 56-pin 8 x 8 QFN packageNXP Semiconductors PF8101 PF8201 9-channel power management integrated circuit for high performance applications 3 Simplified application diagram PF8101 / PF8201 MCU VSNVS VDD SNVS BUCK1 VDD MAIN VDD GPU BUCK2 VIN: VDD CPU(A35) 2.7 V to 5.5 V VDD DDRIO BUCK5 1.8 V I/O BUCK6 (LV GPIO) 3.3 V I/O BUCK7 (HV GPIO) LDO1 VDD SCU LDO2 SDCARD0 LDO3 2.5 V l/O CONTROL INTERFACING AND SIGNALS 2 I C COMMUNICATIONS 2 I C SIMCARD eMMC Supply SD Card Ethernet DRAM LPDDR MISCELLANEOUS Memory PERIPHERALS aaa-029315 Figure 1.Simplified application diagram 4 Ordering information Table 1.Device options Type Package Name Description Version PF8101 (automotive) HVQFN56, plastic, thermally enhanced very thin quad flat non-leaded package, SOT684-21 wettable flanks 56 terminals 0.5 mm pitch 8 mm x 8 mm x 0.85 mm body (DD/SC) PF8201 (automotive) HVQFN56 PF8101 (industrial) HVQFN56, plastic, thermally enhanced very thin quad flat non-leaded package, SOT684-21 56 terminals 0.5 mm pitch 8 mm x 8 mm x 0.85 mm body Table 2.Ordering information 1 Part number Target market NXP processor System comments Safety grade OTP ID MC33PF8101A0ES Automotive n/a Not programmed QM n/a MC34PF8101A0EP Industrial n/a Not programmed QM n/a MC33PF8201A0ES Automotive n/a Not programmed ASIL B n/a 1 To order parts in tape and reel, add the R2 suffix to the part number. PF8101 PF8201 All information provided in this document is subject to legal disclaimers. NXP B.V. 2021. All rights reserved. Product data sheet Rev. 4 24 February 2021 2 / 126

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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