Product Information

CBTL06GP213EEJ

CBTL06GP213EEJ electronic component of NXP

Datasheet
NXP Semiconductors Hex Multiplexer 50-Pin TFBGA

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.8272 ea
Line Total: USD 3.83

4898 - Global Stock
Ships to you between
Mon. 27 May to Wed. 29 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2360 - WHS 1


Ships to you between Mon. 27 May to Wed. 29 May

MOQ : 1
Multiples : 1
1 : USD 2.6444
10 : USD 2.2701
100 : USD 1.9924
250 : USD 1.8717
500 : USD 1.6784
1000 : USD 1.4369
3000 : USD 1.3765
6000 : USD 1.3765
9000 : USD 1.3645

     
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RoHS - XON
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Mxhts
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CBTL06GP213 Second-generation high performance general purpose switch Rev. 3.1 13 December 2016 Product data sheet 1. General description The CBTL06GP213 is a six-channel (hex) multiplexer for DisplayPort, HDMI and PCI Express applications at Generation 2 (Gen2) speeds. It provides four differential channels capable of 1 : 2 switching or 2 : 1 multiplexing bidirectional, AC-coupled PCI Express, DisplayPort signals, USB3 SuperSpeed or DC coupled TMDS signals, using high-bandwidth pass-gate technology. It provides support for high common-mode/bias voltage on the high-speed differential channels. Additionally, it provides for switching/multiplexing of the Hot Plug Detect signal as well as the AUX or DDC (Display Data Channel) signals, for a total of six channels on the display side. The AUX and DDC channels provide a four-position multiplexer such that an additional level of multiplexing can be accomplished when AUX and DDC I/Os are on separate pins of the display source device. The CBTL06GP213 is designed for Gen2 speeds, supporting 5.0 Gbit/s for PCI Express, 5.4 Gbit/s for DisplayPort or 6 Gbit/s for HDMI 2.0. It consumes 490 A current (typical) in operational mode and provides a shutdown function to support battery-powered applications. A typical application of CBTL06GP213 is on applications where one of two GPU display sources must be selected to connect to a display sink device or connector. A controller chip selects which path to use by setting a select signal HIGH or LOW. Due to the non-directional nature of the signal paths (which use high-bandwidth pass gate technology), the CBTL06GP213 can also be used in the reverse topology, for example, to connect one display source device to one of two display sink devices or connectors. 2. Features and benefits 1 : 2 switching or 2 : 1 multiplexing of DisplayPort (v1.2 - 5.4 Gbit/s) PCI Express (v2.0 - 5.0 Gbit/s) signals, USB3 SuperSpeed or HDMI 2.0 (6 Gbit/s) TMDS signals 4 high-speed differential channels with 2 : 1 muxing/switching for DisplayPort or PCI Express or HDMI signals 1 channel with 4 : 1 or 4 : 2 muxing/switching for AUX at 1 Mbit/s or DDC signals, USB2 signals 1 channel with 2 : 1 muxing/switching for single-ended HPD signal High-bandwidth analog pass-gate technology Supports high-speed signal switching over a wide common-mode range and differential swing R on DP high-speed channels: 7 ONCBTL06GP213 NXP Semiconductors Second-generation high performance general purpose switch Low insertion loss: 0.9 dB at 100 MHz 1.1 dB at 1.35 GHz 1.3 dB at 2.7 GHz 3 dB bandwidth at 9.5 GHz Low crosstalk: 32 dB at 2.7 GHz Low off-state isolation: 23 dB at 2.7 GHz Low return loss: 19 dB at 2.7 GHz Very low intra-pair skew (5 ps typical) Very low inter-pair skew (< 80 ps) Switch/multiplexer position select CMOS input Shutdown mode CMOS input Supports backdrive protection Single 3.3 V power supply Operation current of 490 A typical, shut-down current 10 A maximum ESD 2 kV HBM, 500 V CDM Available in 5 mm 5 mm, 0.5 mm ball pitch TFBGA50 package 3. Applications Motherboard applications requiring DisplayPort, HDMI, PCI Express, and USB switching/multiplexing Docking stations Notebook computers Chip sets requiring flexible allocation of PCI Express or DisplayPort I/O pins to board connectors 4. Ordering information Table 1. Ordering information Type number Topside Solder process Package marking Name Description Version 1 CBTL06GP213EE GP213 Pb-free (SnAgCu TFBGA50 plastic thin fine-pitch ball grid array package SOT1345-1 2 solder compound) 50 balls body 5 5 0.8 mm 1 Industrial temperature range. 2 Total height including solder balls after printed circuit board mounting = 1.15 mm. For more information on product marking, refer to www.nxp.com/products/related/package-markings.html. CBTL06GP213 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet Rev. 3.1 13 December 2016 2 of 19

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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