BYV29FX-600 NXP

BYV29FX-600 Enhanced ultrafast power diode Rev. 5 16 April 2012 Product data sheet 1. Product profile 1.1 General description Enhanced ultrafast power diode in a SOD113 (2-lead TO-220F) plastic package. 1.2 Features and benefits High thermal cycling performance Low thermal resistance Isolated package Soft recovery characteristic Low on-state losses 1.3 Applications Dual Mode (DCM and CCM) PFC Power Factor Correction (PFC) for Interleaved Topology 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V repetitive peak reverse voltage - - 600 V RRM I average forward current square-wave pulse =0.5 --9 A F(AV) T 72 C see Figure 1 see Figure 2 h Static characteristics V forward voltage I =8A T = 25 C see Figure 5 - 1.45 1.9 V F F j I =8A T =150 C see Figure 5 - 1.25 1.7 V F j TO-220FBYV29FX-600 NXP Semiconductors Enhanced ultrafast power diode 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K cathode mb K A 2 A anode 001aaa020 mb n.c. mounting base isolated 1 2 SOD113 (TO-220F) 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BYV29FX-600 TO-220F plastic single-ended package isolated heatsink mounted SOD113 1 mounting hole 2-lead TO-220full pac 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V repetitive peak reverse voltage - 600 V RRM V crest working reverse voltage - 600 V RWM V reverse voltage DC - 600 V R I average forward current square-wave pulse =0.5 T 72 C -9 A F(AV) h see Figure 1 see Figure 2 I repetitive peak forward current square-wave pulse =0.5 t = 25 s -18 A FRM p T 72 C h I non-repetitive peak forward current sine-wave pulse t = 10 ms -91 A FSM p T =25 C see Figure 3 j(init) sine-wave pulse t = 8.3 ms - 100 A p T =25 C see Figure 3 j(init) T storage temperature -40 150 C stg T junction temperature - 150 C j BYV29FX-600 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 16 April 2012 2 of 11