Product Information

MT18HTF51272PDZ-80EC1

MT18HTF51272PDZ-80EC1 electronic component of Micron

Datasheet
DRAM Module DDR2 SDRAM 4Gbyte 240RDIMM Tray

Manufacturer: Micron
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 429.3984 ea
Line Total: USD 429.4

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1
1 : USD 429.3984
10 : USD 386.4553
25 : USD 343.517
100 : USD 325.4371

     
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1GB, 2GB, 4GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM Features DDR2 SDRAM RDIMM MT18HTF12872PDZ 1GB MT18HTF25672PDZ 2GB MT18HTF51272PDZ 4GB Figure 1: 240-Pin RDIMM (MO-237 R/C G) Features Module height: 30mm (1.181in) 240-pin, registered dual in-line memory module Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, or PC2-6400 1GB (128 Meg x 72), 2GB (256 Meg x 72), 4GB (512 Meg x 72) Supports ECC error detection and correction Options Marking V = V = +1.8V DD DDQ Parity P V = 1.73.6V DDSPD Operating temperature JEDEC-standard 1.8V I/O (SSTL 18-compatible) Commercial (0C T +70C) None A Differential data strobe (DQS, DQS ) option 1 Industrial (40C T +85C) T A 4n-bit prefetch architecture Package Dual rank 240-pin DIMM (halogen-free) Z 2 Frequency/CL Multiple internal device banks for concurrent 2.5ns CL = 5 (DDR2-800) -80E operation 2.5ns CL = 6 (DDR2-800) -800 Programmable CAS latency (CL) 3.0ns CL = 5 (DDR2-667) -667 Posted CAS additive latency (AL) t 1. Contact Micron for industrial temperature Notes: WRITE latency = READ latency - 1 CK module offerings. Programmable burst lengths (BL): 4 or 8 2. CL = CAS (READ) latency registered mode Adjustable data-output drive strength will add one clock cycle to CL. 64ms, 8192-cycle refresh On-die termination (ODT) Serial presence-detect (SPD) with EEPROM Gold edge contacts Halogen-free Table 1: Key Timing Parameters Data Rate (MT/s) t t t Speed Industry RCD RP RC Grade Nomenclature CL = 6 CL = 5 CL = 4 CL = 3 (ns) (ns) (ns) -80E PC2-6400 800 800 533 400 12.5 12.5 55 -800 PC2-6400 800 667 533 400 15 15 55 -667 PC2-5300 667 553 400 15 15 55 -53E PC2-4200 553 400 15 15 55 -40E PC2-3200 400 400 15 15 55 PDF: 09005aef83d3d893 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 htf18c128 256 512x72pdz.pdf - Rev. F 4/14 EN 2009 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.1GB, 2GB, 4GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM Features Table 2: Addressing Parameter 1GB 2GB 4GB Refresh count 8K 8K 8K Row address 16K A 13:0 16K A 13:0 32K A 14:0 Device bank address 4 BA 1:0 8 BA 2:0 8 BA 2:0 Device configuration 512Mb (64 Meg x 8) 1Gb (128 Meg x 8) 2Gb (256 Meg x8) Column address 1K A 9:0 1K A 9:0 1K A 9:0 Module rank address 2 S 1:0 2 S 1:0 2 S 1:0 Table 3: Part Numbers and Timing Parameters 1GB 1 Base device: MT47H64M8, 512Mb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT18HTF12872PDZ-80E 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF12872PTZ-80E 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF12872PDZ-800 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF12872PTZ-800 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF12872PDZ-667 1GB 128 Meg x 72 5.3 GB/s 3.0ns/667 MT/s 5-5-5 MT18HTF12872PTZ-667 1GB 128 Meg x 72 5.3 GB/s 3.0ns/667 MT/s 5-5-5 Table 4: Part Numbers and Timing Parameters 2GB 1 Base device: MT47H128M8, 1Gb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT18HTF25672PDZ-80E 2GB 256 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF25672PTZ-80E 2GB 256 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF25672PDZ-800 2GB 256 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF25672PTZ-800 2GB 256 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF25672PDZ-667 2GB 256 Meg x 72 5.3 GB/s 3.0ns/667 MT/s 5-5-5 MT18HTF25672PTZ-667 2GB 256 Meg x 72 5.3 GB/s 3.0ns/667 MT/s 5-5-5 Table 5: Part Numbers and Timing Parameters 4GB 1 Base device: MT47H256M8, 2Gb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT18HTF51272PDZ-80E 4GB 512 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF51272PTZ-80E 4GB 512 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF51272PDZ-800 4GB 512 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF51272PTZ-800 4GB 512 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 PDF: 09005aef83d3d893 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 htf18c128 256 512x72pdz.pdf - Rev. F 4/14 EN 2009 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

8542.32.00 33 No ..Memory cards (other than ""smart"" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
EL9
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)

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