Product Information

PCX7457VGU933NC

PCX7457VGU933NC electronic component of Microchip

Datasheet
Microprocessors - MPU

Manufacturer: Microchip
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PCX7457VGU933NC
Microchip

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Manufacturer
Product Category
Core
Data Bus Width
Maximum Clock Frequency
Operating Supply Voltage
Number of Cores
Mounting Style
Package / Case
L1 Cache Instruction Memory
L1 Cache Data Memory
Minimum Operating Temperature
Maximum Operating Temperature
Memory Type
Brand
I/O Voltage
Instruction Type
L2 Cache Instruction / Data Memory
Number Of Timers/Counters
Processor Series
Watchdog Timers
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Features 3000 Dhrystone 2.1 MIPS at 1.3 GHz  Selectable Bus Clock (30 CPU Bus Dividers up to 28x)  13 Selectable Core-to-L3 Frequency Divisors  Selectable MPx/60x Interface Voltage (1.8V, 2.5V)  Selectable L3 Interface of 1.8V or 2.5V  P Typical 12.6W at 1 GHz at V = 1.3V; 8.3W at 1 GHz at V = 1.1V, Full Operating D DD DD Conditions  Nap, Doze and Sleep Modes for Power Saving PowerPC 7457  Superscalar (Four Instructions Fetched Per Clock Cycle)  4 GB Direct Addressing Range 52 RISC  Virtual Memory: 4 Hexabytes (2 )  64-bit Data and 36-bit Address Bus Interface Microprocessor  Integrated L1: 36 KB Instruction and 32 KB Data Cache  Integrated L2: 512 KB  11 Independent Execution Units and Three Register Files  Write-back and Write-through Operations PC7457  f Max = 1 GHz (1.2 GHz to be Confirmed) INT  f Max = 133 MHz/166 MHz BUS Description The PC7457 is implementations of the PowerPC microprocessor family of reduced instruction set computer (RISC) microprocessors. This document describes pertinent electrical and physical characteristics of the PC7457. The PC7457 is the fourth implementation of the fourth generation (G4) microproces- sors from Freescale. The PC7457 implements the full PowerPC 32-bit architecture and is targeted at networking and computing systems applications. The PC7457 con- sists of a processor core, a 512 Kbyte L2, and an internal L3 tag and controller which support a glueless backside L3 cache through a dedicated high-bandwidth interface. The core is a high-performance superscalar design supporting a double-precision floating-point unit and a SIMD multimedia unit. The memory storage subsystem sup- ports the MPX bus interface to main memory and other system resources. The L3 interface supports 1, 2, or 4M bytes of external SRAM for L3 cache and/or private memory data. For systems implementing 4M bytes of SRAM, a maximum of 2M bytes may be used as cache; the remaining 2M bytes must be private memory. Note that the PC7457 is a footprint-compatible, drop-in replacement in a PC7455 application if the core power supply is 1.3V. Rev. 5345DHIREL07/06Screening  CBGA Upscreenings Based on Atmel Standards  Full Military Temperature Range (T = -55 C, +125 C), J Industrial Temperature Range (T = -40 C, +110 C) J  HCTE Package for the 7457 G suffix CBGA 483 Ceramic Ball Grid Array GH suffix HITCE 483 Ceramic Ball Grid Array 2 PC7457 5345DHIREL07/06

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
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