Product Information

CY7C25632KV18-400BZXI

CY7C25632KV18-400BZXI electronic component of Infineon

Datasheet
SRAM Chip Sync Dual 1.8V 72M-bit 4M x 18 0.45ns 165-Pin FBGA Tray

Manufacturer: Infineon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 286.9456 ea
Line Total: USD 286.95

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 272
Multiples : 1
272 : USD 379.8249

0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 2
Multiples : 2
2 : USD 336.0836

0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1
1 : USD 286.9456
5 : USD 260.3766

     
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CY7C25632KV18 CY7C25652KV18 72-Mbit QDR II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency) with ODT 72-Mbit QDR II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency) with ODT JTAG 1149.1 compatible test access port Features Phase-locked loop (PLL) for accurate data placement Separate independent read and write data ports Supports concurrent transactions Configurations 550 MHz clock for high bandwidth With Read Cycle Latency of 2.5 cycles Four-word burst for reducing address bus frequency CY7C25632KV18 4 M 18 Double data rate (DDR) interfaces on both read and write ports CY7C25652KV18 2 M 36 (data transferred at 1100 MHz) at 550 MHz Functional Description Available in 2.5 clock cycle latency Two input clocks (K and K) for precise DDR timing The CY7C25632KV18 and CY7C25652KV18 are 1.8 V Synchronous Pipelined SRAMs, equipped with QDR II+ SRAM uses rising edges only architecture. Similar to QDR II architecture, QDR II+ architecture Echo clocks (CQ and CQ) simplify data capture in high-speed consists of two separate ports: the read port and the write port to systems access the memory array. The read port has dedicated data outputs to support read operations and the write port has Data valid pin (QVLD) to indicate valid data on the output dedicated data inputs to support write operations. QDR II+ On-die termination (ODT) feature architecture has separate data inputs and data outputs to completely eliminate the need to turn-around the data bus that Supported for D , BWS , and K/K inputs [x:0] [x:0] exists with common I/O devices. Each port is accessed through Single multiplexed address input bus latches address inputs a common address bus. Addresses for read and write addresses for read and write ports are latched on alternate rising edges of the input (K) clock. Accesses to the QDR II+ read and write ports are completely Separate port selects for depth expansion independent of one another. To maximize data throughput, both Synchronous internally self-timed writes read and write ports are equipped with DDR interfaces. Each address location is associated with four 18-bit words QDR II+ operates with 2.5 cycle read latency when DOFF is (CY7C25632KV18), or 36-bit words (CY7C25652KV18) that asserted HIGH burst sequentially into or out of the device. Because data is Operates similar to QDR I device with 1 cycle read latency when transferred into and out of the device on every rising edge of both DOFF is asserted LOW input clocks (K and K), memory bandwidth is maximized while simplifying system design by eliminating bus turn-arounds. Available in 18, and 36 configurations These devices have an On-Die Termination feature supported Full data coherency, providing most current data for D , BWS , and K/K inputs, which helps eliminate [x:0] [x:0] [1] external termination resistors, reduce cost, reduce board area, Core V = 1.8 V 0.1 V; I/O V = 1.4 V to V DD DDQ DD and simplify board routing. Supports both 1.5 V and 1.8 V I/O supply Depth expansion is accomplished with port selects, which HSTL inputs and variable drive HSTL output buffers enables each port to operate independently. Available in 165-ball FBGA package (13 15 1.4 mm) All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output Offered in both Pb-free and non Pb-free packages registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry. Selection Guide Description 550 MHz 500 MHz 450 MHz 400 MHz Unit Maximum Operating Frequency 550 500 450 400 MHz Maximum Operating Current 18 920 850 780 710 mA 36 1310 1210 1100 1000 Note 1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V = 1.4 V to V . DDQ DD Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 001-66482 Rev. *E Revised May 9, 20141M x 18 Array 512K x 36 Array 1M x 18 Array 512K x 36 Array 1M x 18 Array 512K x 36 Array 1M x 18 Array 512K x 36 Array CY7C25632KV18 CY7C25652KV18 Logic Block Diagram CY7C25632KV18 18 D [17:0] Write Write Write Write 20 Address A Reg Reg Reg Reg (19:0) Register 20 Address A (19:0) Register K RPS Control CLK K Logic Gen. DOFF Read Data Reg. CQ 72 V 36 REF 18 CQ Reg. Reg. Control WPS 18 Logic 18 18 36 BWS Q Reg. [1:0] [17:0] 18 QVLD Logic Block Diagram CY7C25652KV18 36 D [35:0] Write Write Write Write 19 Address A Reg Reg Reg Reg (18:0) Register 19 Address A (18:0) Register RPS K Control CLK K Logic Gen. DOFF Read Data Reg. CQ 144 V 72 REF CQ 36 Reg. Reg. Control WPS 36 Logic 36 72 36 Q BWS Reg. [3:0] [35:0] 36 QVLD Document Number: 001-66482 Rev. *E Page 2 of 32 Write Add. Decode Write Add. Decode Read Add. Decode Read Add. Decode

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
CYP
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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