Product Information

ECC81482EU

ECC81482EU electronic component of XSD

Datasheet
Heat Sinks 60*11*20 RoHS
Manufacturer: XSD
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.3181 ea
Line Total: USD 0.32

97 - Global Stock
Ships to you between
Fri. 10 May to Wed. 15 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
1 - Global Stock


Ships to you between
Fri. 10 May to Wed. 15 May

MOQ : 1
Multiples : 1
1 : USD 0.288
10 : USD 0.2756

Read More Specifications

     
Manufacturer
Product Category
Category
Rohs
Package
Brand Category
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Additional Infomation About Product

The ECC81482EU is an heat-sink-mounted electronic component manufactured by XSD. It features a RoHS-compliant construction and has a size of 60 mm by 11 mm by 20 mm. The ECC81482EU is typically used in consumer and commercial electronics as a heat sink for components such as RAM chips, microprocessors, and power transistors. The ECC81482EU provides increased heat dissipation due to its large footprint and improved thermal conductivity due to the metal used in its construction.

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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