Product Information

W972GG8KB25I

W972GG8KB25I electronic component of Winbond

Datasheet
DRAM Chip DDR2 SDRAM 2Gbit 256Mx8 1.8V 60-Pin WBGA

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 11.9651 ea
Line Total: USD 11.97

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 189
Multiples : 1

Stock Image

W972GG8KB25I
Winbond

189 : USD 17.3109
250 : USD 17.1376
500 : USD 16.9656
1000 : USD 16.7963
2000 : USD 16.6284
2500 : USD 16.4619
3000 : USD 16.2967
4000 : USD 16.1343
5000 : USD 15.9732
10000 : USD 15.8135

0 - WHS 2


Ships to you between Fri. 31 May to Tue. 04 Jun

MOQ : 189
Multiples : 189

Stock Image

W972GG8KB25I
Winbond

189 : USD 12.7633
2646 : USD 12.7633
5103 : USD 12.7633

0 - WHS 3


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

W972GG8KB25I
Winbond

1 : USD 11.9651
10 : USD 10.4746
25 : USD 10.2651

     
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W9751G8KB-25 electronic component of Winbond W9751G8KB-25

DRAM Chip DDR2 SDRAM 512Mbit 32Mx8 1.8V 60-Pin WBGA
Stock : 0

W9751G6KB25TR electronic component of Winbond W9751G6KB25TR

DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin WBGA
Stock : 0

W9751G6KB25I electronic component of Winbond W9751G6KB25I

DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin WBGA
Stock : 0

W9751G6KB25I TR electronic component of Winbond W9751G6KB25I TR

DRAM 512Mb DDR2-800, x16 Ind Temp T&R
Stock : 0

W9751G8KB25TR electronic component of Winbond W9751G8KB25TR

DRAM 512M DDR2-800, x8 T&R
Stock : 0

W9751G6KB-25 electronic component of Winbond W9751G6KB-25

DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin WBGA
Stock : 0

W9751G6KB-18 electronic component of Winbond W9751G6KB-18

DRAM 512Mb DDR2-1066, x16
Stock : 0

W972GG8KB25I TR electronic component of Winbond W972GG8KB25I TR

DRAM 2Gb DDR2-800, x8. Ind temp T&R
Stock : 0

W9751G6KB25L electronic component of Winbond W9751G6KB25L

DRAM 512Mb DDR2-800, x16
Stock : 0

W9751G8KB25I electronic component of Winbond W9751G8KB25I

DRAM 512M DDR2-800, x8 Ind Temp
Stock : 0

Image Description
9-1879208-1 electronic component of TE Connectivity 9-1879208-1

Thin Film Resistors - SMD CPF 0402 56K 0.1% 25PPM 1K RL
Stock : 0

CF12JT47K0 electronic component of Stackpole CF12JT47K0

47 kOhms ±5% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Safety Carbon Film
Stock : 323

AES-ZYNQ-LX electronic component of Avn Engineering AES-ZYNQ-LX

PetaLinux USB Drive
Stock : 0

W972GG6KB25I electronic component of Winbond W972GG6KB25I

DDR2 SDRAM 16M X 8 BANKS X 16 BIT
Stock : 123

PK9GTA electronic component of Schneider PK9GTA

LOAD CENTER GROUND BAR
Stock : 86

CEAWK105C6224MP-F electronic component of Taiyo Yuden CEAWK105C6224MP-F

CAP, MLCC, 0402, 4V, X6S, 0.22
Stock : 1650

AE-T44-I51/505 electronic component of Phyton AE-T44-I51/505

ADAPTER SOCKET 44-QFP TO 40-DIP
Stock : 0

CF12JT470K electronic component of Stackpole CF12JT470K

470 kOhms ±5% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Safety Carbon Film
Stock : 0

CEAREPG02 electronic component of CamdenBoss CEAREPG02

ENCLOSURE, ALUMINIUM, GREY
Stock : 0

21010000 electronic component of Werma 21010000

LIGHT, RED, 12-240V
Stock : 0

W972GG8KB 32M 8 BANKS 8 BIT DDR2 SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 4 2. FEATURES ........................................................................................................................................... 4 3. ORDER INFORMATION ....................................................................................................................... 4 4. KEY PARAMETERS ............................................................................................................................. 5 5. BALL CONFIGURATION ...................................................................................................................... 6 6. BALL DESCRIPTION ............................................................................................................................ 7 7. BLOCK DIAGRAM ................................................................................................................................ 8 8. FUNCTIONAL DESCRIPTION .............................................................................................................. 9 8.1 Power-up and Initialization Sequence ................................................................................................... 9 8.2 Mode Register and Extended Mode Registers Operation ................................................................... 10 8.2.1 Mode Register Set Command (MRS)............................................................................... 10 8.2.2 Extend Mode Register Set Commands (EMRS) .............................................................. 11 8.2.2.1 Extend Mode Register Set Command (1), EMR (1) ................................................ 11 8.2.2.2 DLL Enable/Disable ................................................................................................ 12 8.2.2.3 Extend Mode Register Set Command (2), EMR (2) ................................................ 13 8.2.2.4 Extend Mode Register Set Command (3), EMR (3) ................................................ 14 8.2.3 Off-Chip Driver (OCD) Impedance Adjustment ................................................................ 15 8.2.3.1 Extended Mode Register for OCD Impedance Adjustment .................................... 16 8.2.3.2 OCD Impedance Adjust .......................................................................................... 16 8.2.3.3 Drive Mode ............................................................................................................. 17 8.2.4 On-Die Termination (ODT) ............................................................................................... 18 8.2.5 ODT related timings ......................................................................................................... 18 8.2.5.1 MRS command to ODT update delay ..................................................................... 18 8.3 Command Function ............................................................................................................................. 20 8.3.1 Bank Activate Command .................................................................................................. 20 8.3.2 Read Command ............................................................................................................... 21 8.3.3 Write Command ............................................................................................................... 21 8.3.4 Burst Read with Auto-precharge Command ..................................................................... 21 8.3.5 Burst Write with Auto-precharge Command ..................................................................... 21 8.3.6 Precharge All Command .................................................................................................. 21 8.3.7 Self Refresh Entry Command .......................................................................................... 21 8.3.8 Self Refresh Exit Command ............................................................................................. 22 8.3.9 Refresh Command ........................................................................................................... 22 8.3.10 No-Operation Command .................................................................................................. 23 8.3.11 Device Deselect Command .............................................................................................. 23 8.4 Read and Write access modes ........................................................................................................... 23 8.4.1 Posted CAS ................................................................................................................... 23 8.4.1.1 Examples of posted CAS operation ..................................................................... 23 8.4.2 Burst mode operation ....................................................................................................... 24 8.4.3 Burst read mode operation ............................................................................................... 25 8.4.4 Burst write mode operation .............................................................................................. 25 8.4.5 Write data mask ............................................................................................................... 26 8.5 Burst Interrupt ..................................................................................................................................... 26 8.6 Precharge operation ............................................................................................................................ 27 Publication Release Date: Feb. 16, 2017 Revision: A03 - 1 - W972GG8KB 8.6.1 Burst read operation followed by precharge ..................................................................... 27 8.6.2 Burst write operation followed by precharge .................................................................... 27 8.7 Auto-precharge operation ................................................................................................................... 27 8.7.1 Burst read with Auto-precharge ....................................................................................... 28 8.7.2 Burst write with Auto-precharge ....................................................................................... 28 8.8 Refresh Operation ............................................................................................................................... 29 8.9 Power Down Mode .............................................................................................................................. 29 8.9.1 Power Down Entry ........................................................................................................... 30 8.9.2 Power Down Exit .............................................................................................................. 30 8.10 Input clock frequency change during precharge power down ............................................................. 30 9. OPERATION MODE ........................................................................................................................... 31 9.1 Command Truth Table ........................................................................................................................ 31 9.2 Clock Enable (CKE) Truth Table for Synchronous Transitions ........................................................... 32 9.3 Data Mask (DM) Truth Table ............................................................................................................... 32 9.4 Function Truth Table ........................................................................................................................... 33 9.5 Simplified Stated Diagram ................................................................................................................... 36 10. ELECTRICAL CHARACTERISTICS ................................................................................................... 37 10.1 Absolute Maximum Ratings ................................................................................................................ 37 10.2 Operating Temperature Condition ....................................................................................................... 37 10.3 Recommended DC Operating Conditions ........................................................................................... 37 10.4 ODT DC Electrical Characteristics ...................................................................................................... 38 10.5 Input DC Logic Level ........................................................................................................................... 38 10.6 Input AC Logic Level ........................................................................................................................... 38 10.7 Capacitance ........................................................................................................................................ 39 10.8 Leakage and Output Buffer Characteristics ........................................................................................ 39 10.9 DC Characteristics .............................................................................................................................. 40 10.10 IDD Measurement Test Parameters .......................................................................................... 42 10.11 AC Characteristics ..................................................................................................................... 43 10.11.1 AC Characteristics and Operating Condition for -18 speed grade ................................... 43 10.11.2 AC Characteristics and Operating Condition for -25/25I/-3 speed grades ........................ 45 10.12 AC Input Test Conditions ........................................................................................................... 66 10.13 Differential Input/Output AC Logic Levels .................................................................................. 66 10.14 AC Overshoot / Undershoot Specification ................................................................................. 67 10.14.1 AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 67 10.14.2 AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 67 11. TIMING WAVEFORMS ....................................................................................................................... 68 11.1 Command Input Timing ....................................................................................................................... 68 11.2 ODT Timing for Active/Standby Mode ................................................................................................. 69 11.3 ODT Timing for Power Down Mode .................................................................................................... 69 11.4 ODT Timing mode switch at entering power down mode .................................................................... 70 11.5 ODT Timing mode switch at exiting power down mode ...................................................................... 71 11.6 Data output (read) timing .................................................................................................................... 72 11.7 Burst read operation: RL=5 (AL=2, CL=3, BL=4) ................................................................................ 72 11.8 Data input (write) timing ...................................................................................................................... 73 11.9 Burst write operation: RL=5 (AL=2, CL=3, WL=4, BL=4) .................................................................... 73 11.10 Seamless burst read operation: RL = 5 ( AL = 2, and CL = 3, BL = 4) ...................................... 74 11.11 Seamless burst write operation: RL = 5 ( WL = 4, BL = 4) ......................................................... 74 11.12 Burst read interrupt timing: RL =3 (CL=3, AL=0, BL=8) ............................................................. 75 11.13 Burst write interrupt timing: RL=3 (CL=3, AL=0, WL=2, BL=8) .................................................. 75 11.14 Write operation with Data Mask: WL=3, AL=0, BL=4) ............................................................... 76 Publication Release Date: Feb. 16, 2017 Revision: A03 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted