X-On Electronics has gained recognition as a prominent supplier of W71NW11GF1EW multichip packages across the USA, India, Europe, Australia, and various other global locations. W71NW11GF1EW multichip packages are a product manufactured by Winbond. We provide cost-effective solutions for multichip packages, ensuring timely deliveries around the world.

W71NW11GF1EW Winbond

W71NW11GF1EW electronic component of Winbond
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See Product Specifications
Part No.W71NW11GF1EW
Manufacturer: Winbond
Category:Multichip Packages
Description: Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

4500: USD 8.086 ea
Line Total: USD 36387

Availability - 0
MOQ: 4500  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 07 Jun to Thu. 13 Jun

MOQ : 4500
Multiples : 1
4500 : USD 8.086
45000 : USD 7.9027
450000 : USD 6.8315
2250000 : USD 6.2764
4500000 : USD 6.2712

0 - WHS 2


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 4500
Multiples : 4500
4500 : USD 7.4623

     
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We are delighted to provide the W71NW11GF1EW from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W71NW11GF1EW and other electronic components in the Multichip Packages category and beyond.
Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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