Product Information

W29N04GVSIAA

W29N04GVSIAA electronic component of Winbond

Datasheet
NAND Flash 4G-bit NAND flash, 3V x 8bit

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 96
Multiples : 96

Stock Image

W29N04GVSIAA
Winbond

96 : USD 8.1428
480 : USD 8.0981
960 : USD 8.0535
2400 : USD 8.0076
4800 : USD 7.9629
12000 : USD 7.9157
24000 : USD 7.8698
48000 : USD 7.8225
60000 : USD 7.7753
N/A

Obsolete
0 - Global Stock

MOQ : 96
Multiples : 96

Stock Image

W29N04GVSIAA
Winbond

96 : USD 7.7522
288 : USD 7.1484
576 : USD 6.8948
N/A

Obsolete
     
Manufacturer
Product Category
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W631GG6KB-15 electronic component of Winbond W631GG6KB-15

WBGA-96 DDR SDRAM ROHS
Stock : 0

W631GG6KB12I electronic component of Winbond W631GG6KB12I

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA
Stock : 0

W631GG6KB-12 electronic component of Winbond W631GG6KB-12

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA
Stock : 0

W39L512P-90 electronic component of Winbond W39L512P-90

New 64Kx8 3.3V 4K byte per PLC
Stock : 0

W631GG6KB15I electronic component of Winbond W631GG6KB15I

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA
Stock : 0

W631GG6KB15I TR electronic component of Winbond W631GG6KB15I TR

1G DDR3 SDRAM, X16, INDUSTRIAL
Stock : 0

W29N04GZBIBA electronic component of Winbond W29N04GZBIBA

NAND Flash 4G-bit NAND flash, 1.8V, 4-bit ECC, 1.8V, x8
Stock : 0

W631GG6MB-12 electronic component of Winbond W631GG6MB-12

DRAM 1G DDR3 SDRAM, x16, 800MHz
Stock : 147

W29N08GVBIAA electronic component of Winbond W29N08GVBIAA

NAND Flash 4G-bit NAND flash, 3V x 8bit
Stock : 0

W29N08GVSIAA electronic component of Winbond W29N08GVSIAA

NAND Flash 4G-bit NAND flash, 3V x 8bit
Stock : 0

Image Description
XC7VX485T-2FFG1761C electronic component of Xilinx XC7VX485T-2FFG1761C

FPGA Virtex-7 XT Family 485760 Cells 28nm Technology 1V 1761-Pin FCBGA
Stock : 0

XC7WT14GD electronic component of NXP XC7WT14GD

IC, INV, SCHMITT TRIGGER, XSON8U
Stock : 0

XC7Z010-L1CLG400I electronic component of Xilinx XC7Z010-L1CLG400I

FPGA Zynq-7000 28000 Cells 28nm Technology 1V 400-Pin CS-BGA
Stock : 0

XC7Z015-2CLG485E electronic component of Xilinx XC7Z015-2CLG485E

MPU Zynq-7000 RISC 32-Bit 766MHz 1.5V/2V/2.5V 485-Pin CSBGA
Stock : 0

XC7Z020-1CLG400I electronic component of Xilinx XC7Z020-1CLG400I

MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 400-Pin CS-BGA
Stock : 0

XC7Z020-2CLG400E electronic component of Xilinx XC7Z020-2CLG400E

MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 400-Pin CS-BGA
Stock : 0

XC7Z020-L1CLG400I electronic component of Xilinx XC7Z020-L1CLG400I

FPGA Zynq-7000 85000 Cells 28nm Technology 1V 400-Pin CS-BGA
Stock : 0

XC7Z020-L1CLG484I electronic component of Xilinx XC7Z020-L1CLG484I

FPGA Zynq-7000 85000 Cells 28nm Technology 1V 484-Pin CSBGA Tray
Stock : 0

VLD25-500-SMT electronic component of CUI Inc VLD25-500-SMT

LED SUPPLY CC BUCK 3.3-36V 500MA
Stock : 0

XC7Z030-1FBG676C electronic component of Xilinx XC7Z030-1FBG676C

IC SOC CORTEX ZYNQ K7 676FBGA
Stock : 0

W29N04GV W29N04GV 4G-BIT 3.3V NAND FLASH MEMORY th Release Date: December 12 , 2017 1 Revision C W29N04GV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................ 7 2. FEATURES .................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 8 3.1 Pin assignment 48-pin TSOP1(x8) ....................................................................................... 8 3.2 Pin assignment 63 ball VFBGA (x8) ..................................................................................... 9 3.3 Pin Descriptions .................................................................................................................. 10 4. PIN DESCRITPIONS ................................................................................................................... 11 4.1 Chip Enable ( CE) .............................................................................................................. 11 4.2 Write Enable ( WE) ............................................................................................................ 11 4.3 Read Enable ( RE) ............................................................................................................. 11 4.4 Address Latch Enable (ALE) .............................................................................................. 11 4.5 Command Latch Enable (CLE) ........................................................................................... 11 4.6 Write Protect ( WP) ............................................................................................................ 11 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 11 4.8 Input and Output (I/Ox) ....................................................................................................... 11 5. BLOCK DIAGRAM ....................................................................................................................... 12 6. MEMORY ARRAY ORGANIZATION ........................................................................................... 13 6.1 Array Organization (x8) ....................................................................................................... 13 7. MODE SELECTION TABLE ........................................................................................................ 14 8. COMMAND TABLE ...................................................................................................................... 15 9. DEVICE OPERATIONS ............................................................................................................... 17 9.1 READ operation .................................................................................................................. 17 9.1.1 PAGE READ (00h-30h) ........................................................................................................ 17 9.1.2 CACHE READ OPERATIONS .............................................................................................. 17 9.1.3 TWO PLANE READ (00h-00h-30h) ...................................................................................... 21 9.1.4 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 23 9.1.5 READ ID (90h) ...................................................................................................................... 25 9.1.6 READ PARAMETER PAGE (ECh) ....................................................................................... 26 9.1.7 READ STATUS (70h) ........................................................................................................... 28 9.1.8 READ STATUS ENHANCED (78h) ...................................................................................... 30 9.1.9 READ UNIQUE ID (EDh) ...................................................................................................... 31 9.2 PROGRAM operation ......................................................................................................... 32 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 32 9.2.2 SERIAL DATA INPUT (80h) ................................................................................................. 32 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 33 9.2.4 CACHE PROGRAM (80h-15h) ............................................................................................. 33 9.2.5 TWO PLANE PAGE PROGRAM .......................................................................................... 35 9.3 COPY BACK operation ....................................................................................................... 38 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 38 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 38 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 39 9.3.4 TWO PLANE PROGRAM for COPY BACK .......................................................................... 39 9.4 BLOCK ERASE operation .................................................................................................. 43 th Release Date: December 12 , 2017 2 Revision C

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted