Product Information

W25X10CLUXIG TR

W25X10CLUXIG TR electronic component of Winbond

Datasheet
NOR Flash spiFlash, 1M-bit, 4Kb Uniform Sector

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.4772 ea
Line Total: USD 0.48

2013 - Global Stock
Ships to you between
Fri. 24 May to Tue. 28 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2365 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1
1 : USD 0.3943
10 : USD 0.392
25 : USD 0.3865
100 : USD 0.349
250 : USD 0.342
500 : USD 0.342
1000 : USD 0.342

2013 - WHS 2


Ships to you between Fri. 24 May to Tue. 28 May

MOQ : 1
Multiples : 1
1 : USD 0.4772
10 : USD 0.4382
100 : USD 0.3887
500 : USD 0.383
1000 : USD 0.3726
4000 : USD 0.3231
8000 : USD 0.3174
24000 : USD 0.3128
48000 : USD 0.3093

2365 - WHS 3


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 22
Multiples : 1
22 : USD 0.4021
25 : USD 0.3957
100 : USD 0.349
250 : USD 0.342

     
Manufacturer
Product Category
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W25X10CL 2.5 / 3 / 3.3 V 1M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI Publication Release Date: February 17, 2014 - 1 - Revision G W25X10CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 150-MIL ....................................................................................... 5 4. PAD CONFIGURATION USON 2X3-MM ................................................................................... 5 5. PIN DESCRIPTION SOIC AND USON 2X3-MM ........................................................................ 5 5.1 Package Types ............................................................................................................... 6 5.2 Chip Select (/CS) ............................................................................................................ 6 5.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 6 5.4 Write Protect (/WP) ......................................................................................................... 6 5.5 HOLD (/HOLD)................................................................................................................ 6 5.6 Serial Clock (CLK) .......................................................................................................... 6 6. BLOCK DIAGRAM ...................................................................................................................... 7 7. FUNCTIONAL DESCRIPTION.................................................................................................... 8 7.1 SPI OPERATIONS ......................................................................................................... 8 7.1.1 Standard SPI Instructions ................................................................................................. 8 7.1.2 Dual SPI Instructions ........................................................................................................ 8 7.1.3 Hold Function ................................................................................................................... 8 7.2 WRITE PROTECTION .................................................................................................... 9 7.2.1 Write Protect Features ...................................................................................................... 9 8. CONTROL AND STATUS REGISTERS ................................................................................... 10 8.1 STATUS REGISTER .................................................................................................... 10 8.1.1 BUSY .............................................................................................................................. 10 8.1.2 Write Enable Latch (WEL) .............................................................................................. 10 8.1.3 Block Protect Bits (BP1, BP0) ........................................................................................ 10 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 10 8.1.5 Reserved Bits ................................................................................................................. 11 8.1.6 Status Register Protect (SRP) ........................................................................................ 11 8.1.7 Status Register Memory Protection ................................................................................ 12 INSTRUCTIONS ....................................................................................................................... 13 8.1.8 Manufacturer and Device Identification .......................................................................... 13 (1) 8.1.9 Instruction Set ............................................................................................................. 14 8.1.10 Write Enable (06h) ........................................................................................................ 15 8.1.11 Write Enable for Volatile Status Register (50h) ............................................................ 15 8.1.12 Write Disable (04h) ....................................................................................................... 16 8.1.13 Read Status Register (05h) .......................................................................................... 16 8.1.14 Write Status Register (01h) .......................................................................................... 17 8.1.15 Read Data (03h) ........................................................................................................... 18 8.1.16 Fast Read (0Bh) ........................................................................................................... 19 8.1.17 Fast Read Dual Output (3Bh) ....................................................................................... 20 8.1.18 Fast Read Dual I/O (BBh) ............................................................................................. 21 8.1.19 Continuous Read Mode Bits (M7-0) ............................................................................. 23 8.1.20 Continuous Read Mode Reset (FFFFh) ....................................................................... 23 8.1.21 Page Program (02h) ..................................................................................................... 24 8.1.22 Sector Erase (20h) ....................................................................................................... 25 Publication Release Date: February 17, 2014 - 2 - Revision G

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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