Product Information

W25Q64FWSSIG

W25Q64FWSSIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 1.8V 64M-bit 8M x 8 6ns 8-Pin SOIC W
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.1894 ea
Line Total: USD 0.19

4608 - Global Stock
Ships to you between
Wed. 22 May to Tue. 28 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
4094 - WHS 1


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 1
Multiples : 1

Stock Image

W25Q64FWSSIG
Winbond

1 : USD 0.1894

4608 - WHS 2


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 10
Multiples : 1

Stock Image

W25Q64FWSSIG
Winbond

10 : USD 0.1894

Read More Specifications

     
Manufacturer
Product Category
Mounting Style
Package / Case
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Access Time Max
Address Bus
Cell Type
Pin Count
Density
Boot Type
Program/Erase Volt Typ
Programmable
Operating Temperature Classification
Operating Temp Range
Rad Hardened
Operating Supply Voltage Typ
Brand Category
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Additional Infomation About Product

W25Q64FW 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 01, 2016 Revision K W25Q64FW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm ............................................................ 6 3.3 Pin Description SOIC/VSOP 208-mil, WSON 6x5-mm, XSON 4x4-mm .............................. 6 3.4 Ball Configuration WLCSP ................................................................................................... 7 3.5 Ball Description WLCSP ....................................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 4.3 Write Protect (/WP) .............................................................................................................. 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 4.6 Reset (/RESET) .................................................................................................................... 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 SPI / QPI Operations .......................................................................................................... 10 6.1.1 Standard SPI Instructions ..................................................................................................... 10 6.1.2 Dual SPI Instructions ............................................................................................................ 10 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 QPI Instructions .................................................................................................................... 11 6.1.5 Hold Function ....................................................................................................................... 11 6.1.6 Software Reset & Hardware /RESET pin .............................................................................. 11 6.2 Write Protection .................................................................................................................. 13 6.2.1 Write Protect Features ......................................................................................................... 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 14 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ....................................... 15 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 7.1.7 Status Register Protect (SRP1, SRP0) Volatile/Non-Volatile Writable ........................... 15 7.1.8 Erase/Program Suspend Status (SUS) Status Only....................................................... 16 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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