Product Information

W25Q16JVUUIQ TR

W25Q16JVUUIQ TR electronic component of Winbond

Datasheet
NOR Flash spiFlash 3V 16M-bit 4Kb Uniform Sector
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.6376 ea
Line Total: USD 0.64

6779 - Global Stock
Ships to you between
Tue. 14 May to Thu. 16 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
2481 - WHS 1


Ships to you between Wed. 08 May to Tue. 14 May

MOQ : 1
Multiples : 1
1 : USD 0.5325
10 : USD 0.5292
25 : USD 0.5184
100 : USD 0.4758
250 : USD 0.4663
500 : USD 0.4663
1000 : USD 0.4663

6779 - WHS 2


Ships to you between Tue. 14 May to Thu. 16 May

MOQ : 1
Multiples : 1
1 : USD 0.669
10 : USD 0.6049
100 : USD 0.5422
500 : USD 0.5337
1000 : USD 0.5228
5000 : USD 0.483
10000 : USD 0.454
25000 : USD 0.4359

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Moisture Sensitive
Product Type
Factory Pack Quantity :
Subcategory
Tradename
LoadingGif

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Additional Infomation About Product

W25Q16JV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: March 22, 2018, 2018 Revision G W25Q16JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 150/208-mil .................................................................................... 5 3.2 Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm ................. 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, USON 2x3-mm/4x3-mm, XSON 4x4- mm 5 3.4 Ball Configuration WLCSP ................................................................................................... 6 3.5 Ball Description WLCSP ....................................................................................................... 6 4. PIN DESCRIPTIONS ........................................................................................................................ 7 4.1 Chip Select (/CS) .................................................................................................................. 7 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 7 4.3 Write Protect (/WP) ............................................................................................................... 7 4.4 HOLD (/HOLD) ..................................................................................................................... 7 4.5 Serial Clock (CLK) ................................................................................................................ 7 (1) 4.1 Reset (/RESET) ................................................................................................................. 7 5. BLOCK DIAGRAM ............................................................................................................................ 8 6. FUNCTIONAL DESCRIPTIONS ....................................................................................................... 9 6.1 Standard SPI Instructions ..................................................................................................... 9 6.2 Dual SPI Instructions ............................................................................................................ 9 6.1 Quad SPI Instructions........................................................................................................... 9 6.2 Software Reset & Hardware /RESET pin ............................................................................. 9 6.3 Write Protection .................................................................................................................. 10 6.4 Write Protect Features........................................................................................................ 10 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 11 7.1 Status Registers ................................................................................................................. 11 Erase/Write In Progress (BUSY) Status Only ................................................................. 11 Write Enable Latch (WEL) Status Only ........................................................................... 11 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 11 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 12 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 12 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 12 Status Register Protect SRP, SRL) Volatile/Non-Volatile Writable ................................. 13 Erase/Program Suspend Status (SUS) Status Only ....................................................... 14 Security Register Lock Bits (LB3, LB2, LB1) Non-Volatile OTP Writable ......................... 14 8. QUAD ENABLE (QE) VOLATILE/NON-VOLATILE WRITABLE .............................................. 14 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ........................................ 15 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ............................ 15 Reserved Bits Non Functional ........................................................................................ 15 W25Q16JV Status Register Memory Protection (WPS = 0, CMP = 0) ................................. 16 W25Q16JV Status Register Memory Protection (WPS = 0, CMP = 1) ................................. 17 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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