Product Information

627-15ABPE

627-15ABPE electronic component of Wakefield

Datasheet
Heat Sinks High Efficiency Heat Sink for Vertical Board Mounting for TO-220, 38.1mm Height
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

25: USD 2.3834 ea
Line Total: USD 59.58

205 - Global Stock
Ships to you between
Fri. 24 May to Thu. 30 May
MOQ: 25  Multiples: 25
Pack Size: 25

 More Buying Options & Price Grid(s)

Availability Price Quantity
205 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 25
Multiples : 25

Stock Image

627-15ABPE
Wakefield

25 : USD 2.31
100 : USD 2.0212
250 : USD 1.9031
500 : USD 1.8244
1000 : USD 1.7456
2500 : USD 1.5225
5000 : USD 1.3256
7500 : USD 1.3112

194 - WHS 2


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 50
Multiples : 25

Stock Image

627-15ABPE
Wakefield

50 : USD 2.7639

194 - WHS 3


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 50
Multiples : 25

Stock Image

627-15ABPE
Wakefield

50 : USD 2.7639

6305 - WHS 4


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 500
Multiples : 500

Stock Image

627-15ABPE
Wakefield

500 : USD 2.0421

Read More Specifications

     
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Additional Infomation About Product

WTS001 p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks D PAK, TO-220, SOT-223, SOL-20 217 SERIES Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari- ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas- ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers component thermal specifications. FEATURES AND BENEFITS: No interface material is needed Copper with matte tin plating for improved solderability and assembly Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for Tape & Reel and Tube formats EIA standards and ESD protection are specified Can be used with water soluble or no clean SMT solder creams or other pastes Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection) 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55C 1W 16.0C/W 200 LFM 217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55C 1W 16.0C/W 200 LFM 217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55C 1W 16.0C/W 200 LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS 217 HEAT SINK WITH THERMAL PERFORMANCE DDPAK DEVICE 6 LAYER BOARD, D PAK 125C LEAD, 40C AMBIENT 217-36CT6 Device Power Dissipation. W KEY: Device only, NC Device + HS, NC Device + HS, 100 lfm Device + HS, 200 lfm Device + HS, 300 lfm SECTION A-A NOTES TAPE DETAILS 1. Material to be ESD 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6 REEL DETAILS Dimensions: in. 22 Device Tab dT, CWTS001 p1-25 6/14/07 10:54 AM Page 23 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks 217 SERIES D PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESD Material with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) 217-36CT6 REF: JEDEC MO-169 (DD PAK) Dimensions: in. Surface Mount Heat Sink 218 SERIES SMT Devices Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62C rise 2W 21C/W 200LFM 218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62C rise 2W 21C/W 200LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 100 25 80 20 60 15 40 10 20 5 0 0 0 200 400 600 800 1000 0.5 1.0 1.5 2.0 2.5 HEAT DISSIPATED (WATTS) Solid line = 218-40CT5 Dashed Line = 218-40CT3 218-40CT3 218-40CT5 23 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO AMBIENT (C)

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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