Product Information

609-100ABS3

609-100ABS3 electronic component of Wakefield

Datasheet
609-100ABS3
Engineering 609-100ABS3: 3-pin computer fan power connector fitting with ABS housing.

Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

15: USD 4.4524 ea
Line Total: USD 66.79

0 - Global Stock
MOQ: 15  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 15
Multiples : 1

Stock Image

609-100ABS3
Wakefield

15 : USD 4.5938

     
Manufacturer
Product Category
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
623A electronic component of Wakefield 623A

Heat Sinks Low Profile Heat Sink for All Metal-Case Power Semis for TO-3, 120.6x76.2x11.7mm
Stock : 50

623K electronic component of Wakefield 623K

Heat Sinks Low Profile Heat Sink for All Metal-Case Power Semis, No Hole, 120.6x76.2x11.7mm
Stock : 433

624-25AB electronic component of Wakefield 624-25AB

Heat Sinks Omnidirectional Pin Fin Heat Sink for 21mm BGA, Super BGA, PBGA, FPBGA, 6.4mm H
Stock : 4773

624-25ABT5 electronic component of Wakefield 624-25ABT5

Heat Sinks Omnidirection Heat Sink for 21mm BGA/Super BGA/PBGA/FPBGA, 6.4mm, Chomerics T411
Stock : 0

624-35AB electronic component of Wakefield 624-35AB

Heat Sinks Omnidirectional Pin Fin Heat Sink for 21mm BGA, Super BGA, PBGA, FPBGA, 8.9mm H
Stock : 3607

609-50ABS3 electronic component of Wakefield 609-50ABS3

Heat Sinks Heat Sink/Clip for 40/45mm BGA/PowerPC, 73.5x50.8x12.7mm, Bergquist Q-Pad 3
Stock : 210

621A electronic component of Wakefield 621A

Heat Sinks Low Profile Heat Sink for All Metal-Case Power Semis for TO-3, 120.6x38.1x11.7mm
Stock : 355

621K electronic component of Wakefield 621K

Heat Sinks Low Profile Heat Sink for All Metal-Case Power Semis, No Hole, 120.6x38.1x11.7mm
Stock : 135

624-25ABT4E electronic component of Wakefield 624-25ABT4E

Heat Sinks Omnidirectional Heat Sink for 21mm BGA/Super BGA/PBGA/FPBGA, 6.4mm, T410R
Stock : 1003

624-25ABT3 electronic component of Wakefield 624-25ABT3

Heat Sinks Omnidirection Heat Sink for 21mm BGA/Super BGA/PBGA/FPBGA, 6.4mm, Chomerics T412
Stock : 3774

Image Description
6103-0-00-34-00-00-38-0 electronic component of Mill-Max 6103-0-00-34-00-00-38-0

Mill-Max
Stock : 0

610851F00000 electronic component of Aavid 610851F00000

Heat Sinks Extrusion, 8 Foot, 1.31 x 5.38 x 8 Inch
Stock : 0

6-1542000-4 electronic component of TE Connectivity 6-1542000-4

Heat Sinks MSB0.80RC-ASY080FL GP 10 -TR
Stock : 0

6237BG electronic component of Aavid 6237BG

Heat Sinks Hat Section Style, Stamped Heat Sink with Integrated Clip for TO-220, Horizontal Mounting, 25 n Thermal Resistance, Black Anodized
Stock : 10805

623A electronic component of Wakefield 623A

Heat Sinks Low Profile Heat Sink for All Metal-Case Power Semis for TO-3, 120.6x76.2x11.7mm
Stock : 50

623K electronic component of Wakefield 623K

Heat Sinks Low Profile Heat Sink for All Metal-Case Power Semis, No Hole, 120.6x76.2x11.7mm
Stock : 433

624-25AB electronic component of Wakefield 624-25AB

Heat Sinks Omnidirectional Pin Fin Heat Sink for 21mm BGA, Super BGA, PBGA, FPBGA, 6.4mm H
Stock : 4773

624-25ABT5 electronic component of Wakefield 624-25ABT5

Heat Sinks Omnidirection Heat Sink for 21mm BGA/Super BGA/PBGA/FPBGA, 6.4mm, Chomerics T411
Stock : 0

624-35AB electronic component of Wakefield 624-35AB

Heat Sinks Omnidirectional Pin Fin Heat Sink for 21mm BGA, Super BGA, PBGA, FPBGA, 8.9mm H
Stock : 3607

624-35ABT4E electronic component of Wakefield 624-35ABT4E

Heat Sinks Omnidirectional Heat Sink for 21mm BGA/Super BGA/PBGA/FPBGA, 8.9mm, T410R
Stock : 0

The 609-100ABS3 is a 2-piece bi-level heat sink assembly manufactured by Wakefield-Vette. The assembly consists of an extruded aluminum heat sink with a black anodized finish, and a black ABS plastic cap. The heat sink has a fin area of 1,028 square inches, with 19 fins per inch, for maximum heat dissipation. The assembly also includes all necessary hardware for mounting and thermal management. This heat sink assembly is designed for system cooling applications that require a low-profile design and/or vibration resistance.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted