Y2010130150R000T9L

RRTD SimulatorTD Simulator Handy Resistor Simulates RTD Temperature Outputs, Such as PT-100 and PT-1000 FEATURES AND BENEFITS Temperature coefficient of resistance (TCR): 55C to +125C, 25C ref. RTD simulator (C): 2 ppm/C typical (see Table 1) The only resistor with internal RTD simulator (K): 1 ppm/C typical (see Table 1) climate isolation. Resistance tolerance: to 0.005% (50 ppm) Available temperature range (<200C to >+800C), order your RTD Simulator by desired simulated temperature or resistance value. Load life stability: 0.005% after 2,000 hrs at rated R = f(T) power at 70C Any value Power rating: to 0.6 W at +70C can be provided. Resistance range: 10 to 5 k (for higher or lower values, please contact us) Available from our Express Hub VFR resistors are not restricted to standard values www.resistors4u.com specific as required values can be supplied at no extra cost or delivery (e.g., 1K01234 vs. 1k) Electrostatic discharge (ESD): at least to 25 kV Non-inductive, non-capacitive design Rise time: 1 ns effectively no ringing Current noise: 0.010 V /V of applied voltage RMS CLIMATE CONTROL (CC) (<40 dB) Two predictable and opposing physical phenomena Thermal EMF: 0.05 V/C within the composite structure of the resistive alloy and its Voltage coefficient: <0.1 ppm/V substrate are keys to the low absolute TCR capability of a Each RTD Simulator based on the Bulk Metal Foil Bulk Metal Foil resistor: technology comes with a built-in climate control Resistivity of the resistive alloy changes directly with (CC) feature. temperature in free air (resistance of the foil increases when temperature increases.) The Coefficient of Thermal Expansion (CTE) of the alloy INTRODUCTION and the substrate to which the foil alloy is cemented Calibrate all your RTD inputs are different, resulting in a compressive stress on the resistive alloy when temperature increases (resistance The new foil RTD Simulators can simulate RTDs in all of the foil decreases due to compression caused by the types of instruments, such as transmitters, controllers, temperature increases). and data acquisition, process control, and lab equipment, etc. Each resistance unit comes with certification and The TCR of the foil resistor is achieved by matching two printed temperature on the resistor itself. Connect an opposing effectsthe inherent increase in resistance due RTD and instantly read the temperature indicated on the to temperature increase vs. the compressionrelated resistor. decrease in resistance due to that same temperature Better than a decade boxfaster, easier, and much increase. The two effects occur simultaneously, resulting less expensive in an unusually low, predictable, repeatable, and controllable TCR. This new RTD Simulator is a complete compact simulator for checkout and calibration of all RTD instruments in the Due to VPGs Bulk Metal Foil resistor design, this TCR field, shop, or control room. characteristic is accomplished automatically, without selection, and regardless of the resistance value or the The long-term stability conditions of the RTD Simulator date of manufactureeven if years apart are regulated with respect to temperature and humidity. Note * This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) alloy-plated terminations are not RoHS compliant. Please see the information/tables in this datasheet for details. Document No.: 63255Document No.: 63255 For any questions, contact www.vishayfoilresistors.com Revision: 10-Sep-2014Revision: 10-Sep-2014 foil vpgsensors.com 1RTD Simulator Table 1Resistance vs. TCR Figure 1Trimming to Values (55C to +125C, +25C Ref.) (conceptual illustration) RESISTANCE NOMINAL TCR AND RTD VALUE MAX. SPREAD SIMULATOR Interloop () (ppm/C) capacitance Current path reduction before trimming in series RTD-K 80 to <5k 1 2.5 Mutual Current path after trimming RTD-C 80 to <5k 2 2.5 inductance reduction Trimming process due to change removes this material in current RTD-K 1 3.5 from shorting strip area direction changing current path 50 to <80 and increasing resistance RTD-C 2 3.5 Foil shown in black, etched spaces in white Note RTD-K 1 4.5 To acquire a precision resistance value, the Bulk Metal Foil 10 to <50 chip is trimmed by selectively removing built-in shorting bars. To increase the resistance in known increments, marked RTD-C 2 4.5 areas are cut, producing progressively smaller increases in resistance. This method reduces the effect of hot spots and (1) improves the long-term stability of VFR resistors. C refers to C Foil Alloy K refers to the K Foil Alloy. Figure 2Standard Imprinting and Dimensions Front View Rear View L Optional (PT XXXX) W Date Code 14 10 Temperature PT100 VFR Year Week XYZ Resistance H XXXX 109R734 Tolerance RTD-X 0.005% (1) ST SW LL Model Number X = LS C (C-Foil Alloy) Lead Material 22 AWG K (K-Foil Alloy) Round Solder Coated Copper (Pb-free coating available) Notes (1) Standoffs provided to allow proper flushing of flux, debris, and contaminants from under resistor after all solder operations. (2) The standoffs shall be so located as to give a lead clearance of 0.010 minimum between the resistor body and the printed circuit board when the standoffs are seated on the printed circuit board. Table 2Model Selection TIGHTEST AVERAGE DIMENSIONS MAXIMUM TOLERANCE MODEL WEIGHT WORKING VS. LOWEST NUMBER IN VOLTAGE RESISTANCE INCHES mm GRAMS VALUE W: 0.105 0.010 2.67 0.25 RTD-C L: 0.300 0.010 7.62 0.25 (1) 0.005% / 50 (RTD-J) H: 0.326 0.010 8.28 0.25 0.01% / 25 300 0.6 ST: 0.010 min. 0.254 min. 0.02% / 12 SW: 0.040 0.005 1.02 0.13 RTD-K 0.05% / 10 (1) LL: 1.000 0.125 25.4 3.18 (RTD-L) LS: 0.150 0.005 3.81 0.13 (1) 0.200 (5.08 mm) lead spacing availablespecify RTD-J for RTD-C and RTD-L for RTD-K. www.vishayfoilresistors.com For any questions, contact Document No.: 63255 2 foil vpgsensors.com Revision: 10-Sep-2014