Product Information

TSP803H2002BUF

TSP803H2002BUF electronic component of Vishay

Datasheet
Res Thick Film NET 20kOhm 0.1% 1/2W ±50ppm/°C ISOL Molded 8-Pin SIP Thru-Hole

Manufacturer: Vishay
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

100: USD 7.261 ea
Line Total: USD 726.1

0 - Global Stock
MOQ: 100  Multiples: 100
Pack Size: 100
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 15 May to Tue. 21 May

MOQ : 100
Multiples : 100
100 : USD 9.3639
200 : USD 9.0636
400 : USD 7.8453
600 : USD 6.6667
800 : USD 6.4502
1000 : USD 5.335
10000 : USD 4.4753

     
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TSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network (Standard) FEATURES Lead (Pb)-free gold plated terminals standard Gold to gold terminations (no internal solder) Available Exceptional ratio stability over time and Available temperature (R 0.015 % 2000 h at 70 C) Actual Size Rugged low profile molded case 6 pins, 8 pins, and 10 pins available Designed to meet MIL-PRF-83401 characteristic V and H Compatible with automatic insertion equipment These resistor networks are available in 6 pins, 8 pins and 10 pins styles in both standard and custom circuits. They Material categorization: For definitions of compliance incorporate Vishay Dale Thin Films patented passivated please see www.vishay.com/doc 99912 nichrome film to give superior performance on temperature Note coefficient of resistance, thermal stability, noise, voltage * This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For coefficient, power handling and resistance stability. The example, parts with lead (Pb) terminations are not RoHS-compliant. leads are attached to the metallized alumina substrates by Please see the information/tables in this datasheet for details. Thermo-Compression bonding. The body is molded thermoset plastic with gold plated copper alloy leads. This TYPICAL PERFORMANCE product will outperform all of the requirements of ABSOLUTE TRACKING characteristic V and H of MIL-PRF-83401. TCR 25 2 ABSOLUTE RATIO TOL. 0.1 0.05 SCHEMATIC Schematic 01 Schematic 03 Schematic 06 1 234 N 1 23 4 N-1 N 1 234 N STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Passivated nichrome - Pin/Lead Number 6, 8, 10 - Resistance Range 100 to 200 k per resistor - TCR: Absolute 25 ppm/C (standard) - 55 C to + 125 C (1) TCR: Tracking 2 ppm/C (typical less 1 ppm/C equal values) - 55 C to + 125 C Tolerance: Absolute 0.1 % to 1.0 % + 25 C + 25 C Tolerance: Ratio 0.05 % to 0.1 % to R 1 Power Rating: Resistor 0.100 W (per element typical at + 25 C) Maximum at + 70 C Power Rating: Package 0.500 W Maximum at + 70 C Stability: Absolute R 0.05 % 2000 h at + 70 C Stability: Ratio R 0.015 % 2000 h at + 70 C Voltage Coefficient < 0.1 ppm/V - Working Voltage 100 V - Operating Temperature Range - 55 C to + 125 C - Storage Temperature Range - 55 C to + 125 C - Noise < - 30 dB - Thermal EMF < 0.08 V/C - Shelf Life Stability: Absolute R 0.01 % 1 year at + 25 C Shelf Life Stability: Ratio R 0.002 % 1 year at + 25 C Note (1) Consult factory for TCR tracking specifications 01 schematic Revision: 21-Oct-13 Document Number: 60037 1 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 TSP www.vishay.com Vishay Dale Thin Film DIMENSIONS AND IMPRINTING in inches and millimeters DIMENSION INCHES MILLIMETERS Part A 0.035 0.89 Number L B 0.040 1.02 Indicates G Pin 1 C 0.100 0.005 non-accum. 2.54 0.13 Date D 0.019 0.006 typical 0.48 0.15 Code E E 0.187 0.010 4.75 0.25 Vishay F 0.135 3.43 Logo A G 0.095 2.41 F H 0.012 0.004 0.31 0.10 B L (6 Pins) 0.583 0.015 14.81 0.38 H L (8 Pins) 0.783 0.015 19.89 0.38 CD L (10 Pins) 0.983 0.015 24.97 0.38 CONSTRUCTION High Purity Alumina Substrate Gold Plated Sputtered TAMELOX Copper Leads Film System Gold to Gold Thermo-Compression Bond (No Internal Solder) MECHANICAL SPECIFICATIONS Resistive Element Passivated nichrome or tantalum nitride Substrate Material Alumina Body Molded Epoxy Terminals Copper alloy Plating Nickel/gold Model TSP - Lead (Pb)-free Standard Gold plated Model TSPS - Lead (Pb)-free Solder Coated Option Sn96.5, Ag3.0, Cu0.5 Model TSPL - Tin/Lead Solder Coated Option Sn63 Tin/Lead and Lead (Pb)-free Finish Hot solder dip GLOBAL PART NUMBER INFORMATION New Global Part Numbering: TSP6011002BUF TS P6 0 1 1 0 02 B UF TS PS 1 0 0 1 1 0 02 C UF GLOBAL MODEL PIN COUNT TCR TOLERANCE AND SCHEMATICS RESISTANCE PACKAGING (3 or 4 digits) (1 or 2 digits) CHARACTERISTICS RATIO TOLERANCE (1) (2) TSP 6 01 = 5, 7 or 9 R = 25 ppm/C First 3 digits are Absolute Ratio UF = Tubed (3) (Lead (Pb)-free) 8 resistors with H = 50 ppm/C significant figures 0.05 % A = 0.1 % (e4) 10 Pin 1 common K = 100 ppm/C and the last digit 0.1 % B = 0.1 % TSPL 03 = 3, 4 or 5 specifies the 0.1 % C = 0.25 % Note (Tin/lead) isolated resistors number of zeroes 0.1 % (2) D = 0.5 % 01 Schematic TSPS 06 = 5, 7 or 9 to follow. 0.5 % F = 1.0 % greater than (Lead (Pb)-free) series connected e.g.: 1001 = 1K (e1) 250 only 1002 = 10K Note Note (1) (3) Consult factory for TCR tracking specifications 01 schematic Tol. available on 1K and up only. R is reference resistor. 1 Historical Part Number example: TSP803R1001F (for reference purposes only) TSP 8 03 R 1001 F TCR TOLERANCE AND SERIES PINS SCHEMATIC RESISTANCE CHARACTERISTIC RATIO TOLERANCE Revision: 21-Oct-13 Document Number: 60037 2 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000

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8533.10.00 17 No Fixed carbon resistors, composition or film types Free

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