Product Information

SIHD3N50DT4-GE3

SIHD3N50DT4-GE3 electronic component of Vishay

Datasheet
N-Channel 500 V 3A (Tc) 69W (Tc) Surface Mount TO-252AA

Manufacturer: Vishay
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.518 ea
Line Total: USD 1.52

378 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
20 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1
1 : USD 1.056
10 : USD 0.9255
100 : USD 0.6312
500 : USD 0.528
1000 : USD 0.4497
3000 : USD 0.3986
9000 : USD 0.3927
24000 : USD 0.388

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Series
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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SiHD3N50D www.vishay.com Vishay Siliconix D Series Power MOSFET FEATURES D Optimal design DPAK (TO-252) - Low area specific on-resistance - Low input capacitance (C ) iss D - Reduced capacitive switching losses G - High body diode ruggedness Available - Avalanche energy rated (UIS) S Optimal efficiency and operation G - Low cost S - Simple gate drive circuitry N-Channel MOSFET - Low figure-of-merit (FOM): R x Q on g - Fast switching Material categorization: for definitions of compliance PRODUCT SUMMARY please see www.vishay.com/doc 99912 V (V) at T max. 550 DS J R max. () at 25 C V = 10 V 3.2 DS(on) GS APPLICATIONS Q max. (nC) 12 Consumer electronics g - Displays (LCD or plasma TV) Q (nC) 2 gs Q (nC) 3 Server and telecom power supplies gd - SMPS Configuration Single Industrial - Welding - Induction heating - Motor drives Battery chargers ORDERING INFORMATION Package DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) SiHD3N50D-GE3 SiHD3N50DT1-GE3 SiHD3N50DT4-GE3 Lead (Pb)-free and halogen-free SiHD3N50DT5-GE3 SiHD3N50D-BE3 - Lead (Pb)-free SiHD3N50D-E3 - - ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLLIMITUNIT Drain-source voltage V 500 DS Gate-source voltage 30 V V GS Gate-source voltage AC (f > 1 Hz) 30 T = 25 C 3.0 C Continuous drain current (T = 150 C) V at 10 V I J GS D T = 100 C 1.9 A C a Pulsed drain current I 5.5 DM Linear derating factor 0.56 W/C b Single pulse avalanche energy E 10.4 mJ AS Maximum power dissipation P 69 W D Operating junction and storage temperature range T , T -55 to +150 C J stg Drain-source voltage slope T = 125 C 24 J dV/dt V/ns d Reverse diode dV/dt 0.22 c Soldering recommendations (peak temperature) For 10 s 300 C Notes a. Repetitive rating pulse width limited by maximum junction temperature b. V = 50 V, starting T = 25 C, L = 2.3 mH, R = 25 , I = 3 A DD J g AS c. 1.6 mm from case d. I I , starting T = 25 C SD D J S21-0373-Rev. F, 19-Apr-2021 Document Number: 91495 1 For technical questions, contact: hvm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 SiHD3N50D www.vishay.com Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOLTYP.MAX.UNIT Maximum junction-to-ambient R -62 thJA C/W Maximum junction-to-case (drain) R -1.8 thJC SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOLTEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = 250 A 500 - - V DS GS D V temperature coefficient V /T Reference to 25 C, I = 250 A - 0.56 - V/C DS DS J D Gate-source threshold voltage (N) V V = V , I = 250 A 3 - 5 V GS(th) DS GS D Gate-source leakage I V = 30 V - - 100 nA GSS GS V = 500 V, V = 0 V - - 1 DS GS Zero gate voltage drain current I A DSS V = 400 V, V = 0 V, T = 125 C - - 10 DS GS J Drain-source on-state resistance R V = 10 V I = 1.5 A - 2.6 3.2 DS(on) GS D a Forward transconductance g V = 8 V, I = 1.5 A - 1 - S fs DS D Dynamic Input capacitance C - 175 - iss V = 0 V, GS Output capacitance C -2V = 100 V, 1- oss DS f = 1 MHz Reverse transfer capacitance C -5- rss pF Effective output capacitance, C -21 - o(er) b energy related V = 0 V to 400 V, V = 0 V DS GS Effective output capacitance, C -26 - c o(tr) time related Total gate charge Q -6 12 g Gate-source charge Q -2V = 10 V I = 1.5 A, V = 400 V - nC gs GS D DS Gate-drain charge Q -3- gd Turn-on delay time t -12 24 d(on) Rise time t -9 18 r V = 400 V, I = 1.5 A DD D ns R = 9.1 , V = 10 V Turn-off delay time t -1g GS 122 d(off) Fall time t -1326 f Gate input resistance R f = 1 MHz, open drain - 3.3 - g Drain-Source Body Diode Characteristics MOSFET symbol D Continuous source-drain diode current I -- 3 S showing the A G integral reverse Pulsed diode forward current I -- 12 SM P - N junction diode S Diode forward voltage V T = 25 C, I = 1.5 A, V = 0 V - - 1.2 V SD J S GS Reverse recovery time t - 293 - ns rr T = 25 C, I = I = 1.5 A, J F S Reverse recovery charge Q -0.74 - C rr dI/dt = 100 A/s, V = 20 V R Reverse recovery current I -5 - A RRM Notes a. Repetitive rating pulse width limited by maximum junction temperature b. C is a fixed capacitance that gives the same energy as C while V is rising from 0 % to 80 % V oss(er) oss DS DSS c. C is a fixed capacitance that gives the same charging time as C while V is rising from 0 % to 80 % V oss(tr) oss DS DSS S21-0373-Rev. F, 19-Apr-2021 Document Number: 91495 2 For technical questions, contact: hvm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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