Product Information

PATT0603E1001BGT1

PATT0603E1001BGT1 electronic component of Vishay

Datasheet
Vishay Thin Film Thin Film Resistors - SMD .15watt 1Kohm .1%

Manufacturer: Vishay
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.4929 ea
Line Total: USD 0.49

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1
1 : USD 0.4929

0 - WHS 2


Ships to you between Fri. 24 May to Tue. 28 May

MOQ : 1
Multiples : 1
1 : USD 1.4605
10 : USD 1.0108
50 : USD 0.6624
100 : USD 0.6015
250 : USD 0.5577
500 : USD 0.5577

0 - WHS 3


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 15
Multiples : 1
15 : USD 0.8559
25 : USD 0.7074
100 : USD 0.5921
250 : USD 0.5803

     
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PATT www.vishay.com Vishay Dale Thin Film Precision Automotive High Temperature (155 C at Full Rated Power) Thin Film Chip Resistor, AEC-Q200 Qualified FEATURES Resistance range: 1.0 to 1 M AEC-Q200 qualified, table 7F AEC-Q200 qualified, ESD rated class 1C (< 1 k: 1 kV > 1 k: 2 kV) Laser trimmed to any value Intrinsic moisture protected resistor element Moisture resistant to MIL-STD-202, method 106 Tantalum nitride resistor film on alumina substrate 100 % visual inspected per MIL-PRF-55342 LINKS TO ADDITIONAL RESOURCES Laser-trimmed tolerances to 0.1 % Load life stability 0.2 % at 1000 h at 155 C and 100 % Infographics rated power Very low noise and voltage coefficient The terminations consist of an adhesion layer, a leach (< -30 dB, < 0.1 ppm/V) resistant nickel barrier and gold plating compatible with high Sulfur resistant (per ASTM B809-95 humid vapor test) temperature solder systems. Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 CONSTRUCTION T antalum Nitride Resistive Film TYPICAL PERFORMANCE Passivation Gold ABSOLUTE Nickel Barrier TCR 25 High Purity Alumina Substrate TOL. 0.1 Adhesion Layer STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Tantalum nitride - Resistance Range 1.0 to 1 M - TCR: Absolute 25 ppm/C to 100 ppm/C -55 C to +175 C Tolerance: Absolute 0.1 % to 1.0 % +25 C Stability: Absolute 0.2 % 1000 h at 155 C and 100 % rated power Stability: Ratio Not applicable - Voltage Coefficient Less than 0.1 ppm/V - Working Voltage 75 V - Operating Temperature Range -55 C to +250 C - (1) Storage Temperature Range -55 C to +250 C - Noise < -30 dB - Shelf Life Stability: Absolute 100 ppm 1 year at 25 C Note (1) Storage temperature rating is for device only COMPONENT RATINGS CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () 0402 50 75 1.5 to 51K 0603 150 75 2.75 to 120K 0805 200 100 2.75 to 301K 1206 400 200 1.0 to 1M Revision: 08-Mar-2021 Document Number: 60124 1 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 PATT www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches DT D W T E L L CASE SIZE L W T D E 0402 0.042 0.008 0.022 0.005 0.015 0.003 0.010 0.005 0.010 0.005 0603 0.064 0.006 0.032 0.005 0.015 0.003 0.012 0.005 0.015 0.005 0805 0.080 0.006 0.050 0.005 0.015 0.003 0.016 0.008 0.015 0.005 1206 0.126 0.008 0.063 0.005 0.015 0.003 0.020 + 0.005 / - 0.01 0.020 + 0.005 / -0.01 ENVIRONMENTAL TESTS ENVIRONMENTAL TEST CONDITIONS TYPICAL VISHAY PERFORMANCE High temperature storage MIL-STD-202 method 108, 1000 h at 125 C 0.05 % JESD22 method JA-104, 1000 cycles, Temperature cycling 0.115 % -55 C to +155 C Moisture resistance MIL-STD-202 method 106 0.017 % MIL-STD-202 method 103, 1000 h at 85 C, 85 % RH, Biased humidity 0.133 % 10 % rated power MIL-STD-202 method 108, 0.20 % at 100 % rated power and 155 C. Life 1000 h at 155 C Effective film temperature is 200 C. Mechanical shock MIL-STD-202 method 213, condition C 0.008 % Vibration MIL-STD-202 method 204, 10 Hz to 2 kHz 0.008 % Resistance to soldering heat MIL-STD-202 method 210, condition B 0.09 % AEC-Q200-002, human body Electrostatic discharge 0.10 % at 2 kV (< 1 k: 1 kV > 1 k: 2 kV) Solderability MIL-STD-883 method 2003 para 2.3.1 and J-STD-002 Pass Die shear MIL-PRF-55342 Pass Flame retardance AEC-Q200-001 para 4.0 Pass MECHANICAL SPECIFICATIONS Resistive element Tantalum nitride Substrate material Alumina Terminations Gold (10 in. min.) over nickel (50 in. min.) DERATING CURVE Axis Title 100 10000 80 1000 60 40 100 20 0 10 -55 0 50 100 155 200 250 Ambient Temperature (C) Revision: 08-Mar-2021 Document Number: 60124 2 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 2nd line Rated Power (%) 1st line 2nd line

Tariff Desc

8533.10.00 17 No Fixed carbon resistors, composition or film types Free

ELECTRICAL RESISTORS (INCLUDING RHEOSTATS AND POTENTIOMETERS)
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