Product Information

SOM-9X20

SOM-9X20 electronic component of VIA

Datasheet
System-On-Modules - SOM Measuring 8.2cm x 4.5cm, the VIA SOM-9X20 module features 64GB eMMC Flash memory & 4GB LPDDR4 SDRAM onboard and offers rich I/O & display expansion options through its MXM 3.0 314-pin connector.
Manufacturer: VIA
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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1 : USD 283.5
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Additional Infomation About Product

Board Placement SOM Modules GPS/GNSS reciever VIA Snapdragon 820 SoC + SOM-9X20 Wi-Fi + BT 4.1 LGA module POP LPDDR4 RAM Ultra-compact solution for graphics-intensive edge computing applications Features Specifications Qualcomm Snapdragon 820 Model Name SOM-9X20 quad-core SoC Processor Qualcomm Snapdragon 820 quad-core SoC - Two high-performance Kryo cores up to 2.15GHz - Two low power Kryo cores up to 1.593GHz Enhanced video decoding System Memory 4GB POP LPDDR4 RAM supporting 4K 60fps, Storage 64GB eMMC 5.1/UFS 2.0 Flash Memory 8 x 1080p 30fps Graphics Qualcomm Adreno 530 GPU 3D graphics accelerator with 64-bit addressing 624 MHz Built-in Wi-Fi 802.11 a/b/g/n/ac, Graphics engine supporting OpenGL ES 3.1/GEP, GL4.4, DX11.3/4, OpenCL 2.0, Bluetooth 4.1, and GPS Renderscript-Next Supports H.264, VP8, HEVC 8/10-bit, VP9 video decoding up to: 4K 60fps, Compact form factor module 1080p 240fps, 8 x 1080p 30fps with the MXM 3.0 314-pin Trusted Platform Module TPM1.2 : ST33TPM12I2C connector Wireless Connectivity NFA324A-12H32 QCA6174A-1 Wi-Fi 802.11 a/b/g/n/ac + BT 4.1 combo LGA module with 2 antenna connectors Evaluation carrier board Qualcomm WGR7640 GPS/GNSS RF receiver with antenna connector available HDMI Integrated HDMI 2.0 Transmitter Supported I/O through 1 HDMI port MXM 3.0 connector 2 MIPI DSI 4-Lane connectors 3 MIPI CSI 4-Lane connectors 1 USB 3.0 OTG 1 USB 2.0 host 1 SDIO 2 PCM/MI2S 2 Multi-function pins for UART, I C, SPI, GPIO 1 JTAG 2 PCIe 2.0 1-Lane Operating System Android 8.0, Linux Kernel 3.18.44 Operating Temperature -20C ~ 70C Operating Humidity 0% ~ 95% (non-condensing) Form Factor 8.2cm x 4.5cm (3.23 x 1.77 )Carrier Board Back Panel I/O Carrier Board (SOMDB2) Ethernet Power Micro USB 2.0 OTG Button USB 3.0 HDMI DC-in Specifications Model Name SOMDB2 Audio Qualcomm WCD 9335 Audio Codec RealTek RTL8111G Ethernet Controller LAN RealTek RTL8365MB LAN Hub Onboard I/O 1 MIPI DSI LCD panel connector 1 MIPI CSI Interface for camera module 1 P-Cap Touch connector 2 USB 2.0 ports 1 USB 2.0 OTG switch (for Host mode/Device mode) 1 COM connector (TX/RX only for debugging) 1 GPIO connector (8 GPIO) 2 2 I C connectors (for light & proximity sensor and NFC module) 1 Front panel connector 1 JTAG connector 1 Mic-in connector 2 2W speaker connectors 2 Audio module connectors (for VT6093 audio module) 2 Volume buttons 1 Boot switch 1 RTC battery connector 1 Micro SD card slot 1 miniPCIe slot 1 MXM 3.0 slot Back Panel I/O 1 HDMI port 2 USB 3.0 ports 1 Micro USB 2.0 OTG port (for debugging) 2 Gigabit Ethernet ports 1 Power button 1 12V DC-in jack Operating Temperature -20C ~ 70C Operating Humidity 0% ~ 95% (non-condensing) Form Factor 17cm x 8.6cm (6.69 x 3.89 ) Compliance RoHS Ordering Information Model Name SoC Frequency Description 10GWG23Q100A0 Qualcomm Snapdragon SOM module with Qualcomm Snapdragon 820 quad-core SoC, 64GB eMMC/UFS, 820 quad-core SoC 4GB POP LPDDR4 RAM, HDMI, 2 DSI, 3 CSI, USB 3.0, USB 2.0, UART, GPIO, 1 SDIO, 2.15GHz/1.593GHz Wi-Fi + Bluetooth 4.1, GPS/GNSS, 2 PCIe 2.0 1-Lane 10GWH000000A0 N/A SOMDB2 carrier board STK-VT6093-00A1 Qualcomm Snapdragon SOM-9X20 starter kit 820 quad-core SoC 2.15GHz/1.593GHz

HS Compliance

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:

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