KTS101B685M55F0T00

MULTILAYER CERAMIC CHIP CAPACITORS RoHS Compliant / Temperature cycle : 1000 cycles FEATURES 1. Large capacitance by small size. 2. Excellent noise absorption. 3. High permissible ripple current capability. 4. NTF: Temperature cycle : 1000 cycles. APPLICATIONS 1. Smoothing circuit of DC-DC converters. 2. On-board power supplies. 3. Voltage regulators for computers. 3. Noise suppressor for various kinds of equipments. 4. High reliability equipments. CONSTRUCTION Ceramic Dielectric Termination (Tin Plating) Internal Electrode RATINGS 1. Category Temperature Range -55 to +125 2. Rated Voltage Range 25, 50, 100, 250Vdc 3. Rated Capacitance Range 0.010 to 47 F 4. Rated Capacitance Tolerance M (20%) : Standard , K (10%) 5. Temperature Characteristics X7R 6. Rated Ripple Current See No.5 on the following table SPECIFICATIONS No. Items Specification Test Condition 1 Withstand Voltage No abnormality. 250% of rated voltage shall be applied for 5 seconds. (Only 250Vdc product : 475V) 2 Insulation Resistance 100/CR(M ) or 4000(M ) Rated voltage shall be applied for 60 5 seconds at temperature 25 2. whichever is less. 3 Rated Capacitance Within specified tolerance. CR 10F CR>10F Temperature 252 4 Dissipation Factor 5.0% maximum. Frequency 1 0.1kHz 120 12Hz Voltage 1 0.2Vrms 0.5 0.2Vrms 10kHz1MHz (sine curve) 5 Rated Ripple Current Size code 31 32 43 55 76 Ripple voltage Vp shall be less than Arms 0.3 0.5 1.0 2.0 3.0 the rated voltage. Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications. 12 CAT. No. E1002T MULTILAYER CERAMIC CHIP CAPACITORS / SPECIFICATIONS No. Items Specification Test Condition 6 Adhesion No visible damage. Substrate 5N (0.51kgf) for 10 1 seconds Capacitor 7 Bend strength of the face plating Appearance : No visible damage. The substrate shall be bend at a rate of 1mm/s C/C : 15% for 5 seconds. Press bar Press Capacitor Substrate Bending capability* 45 2mm 45 2mm Support *Bending capability NTS : 1mm NTF : 1mm or 2mm 8 Solderability Min. 75% of surface of the termination Solder Pb Free shall be covered with new solder Solder Temperature 245 5 Dipping Time 2 0.5sec. 9 Resistance to Soldering Heat Appearance : No visible damage. Preheating Condition : C/C : 15% Step Temperature Time D.F. : To meet the initial specification. 1 100 10 2min. I.R. : To meet the initial specification. 2 200 10 2min. Solder Temperature : 260 5 Dipping Time : 2 0.5 seconds 10 Temperature Cycle Appearance : No visible damage. Step Temperature () (min.) C/C : 15% 1 Min. Category temperature 3 30 3 D.F. : To meet the initial specification. 2 Room temperature 3 max. I.R. : To meet the initial specification. 3 Max. Category temperature 3 30 3 4 Room temperature 3 max. For above temperature cycle. NTS : For 5 cycles NTF : For 1000 cycles 11 Humidity Load Life Appearance : No abnormality. Temperature : 40 2 Humidity : 90 to 95%RH C/C : 15% D.F. : 10% maximum Voltage : Rated voltage 24 I.R. : 25/CR(M ) or 1000(M ) Time : 500 hours 0 whichever is less. Temperature : 125 3 12 Endurance Appearance : No abnormality. Voltage : Rated voltage C/C : 15% 48 Time : 1000 hours D.F. : 10% maximum 0 I.R. : 50/CR(M ) or 1000(M ) whichever is less. *CR : Rated Capacitance(F) Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications. 13 CAT. No. E1002T