Product Information

HSF110068R0K7

HSF110068R0K7 electronic component of TT Electronics

Datasheet
MELF Resistors 1WATT 68OHM 10%

Manufacturer: TT Electronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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HSF110068R0K7
TT Electronics

1 : USD 1.4302
10 : USD 0.6609
25 : USD 0.4337
100 : USD 0.3543
250 : USD 0.3396
500 : USD 0.3114
1000 : USD 0.2369
1500 : USD 0.2313
3000 : USD 0.2279
N/A

Obsolete
     
Manufacturer
Product Category
Resistance
Power Rating
Tolerance
Temperature Coefficient
Voltage Rating
Case Diameter
Case Length
Operating Temperature Range
Packaging
Product
Series
Brand
Factory Pack Quantity :
Rohs Mouser
Type
Mounting Style
Cnhts
Hts Code
Minimum Operating Temperature
Mxhts
Product Type
Subcategory
Taric
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HSF High Surge Film High Surge Film TM Surface Mount Metal Glaze TM Surface Mount Metal Glaze HSF Series TM Metal Glaze HSF thick lm element 1 Watt and 1/2 Watt power rating red at 1000C High Surge Film to solid ceramic 150C maximum operating temperature 1 Watt and 1/2 Watt power rating TM RoHS - compatible components available Surface Mount Metal Glaze 150C maximum operating temperature TM Up to triple the surge rating of the rugged CHP1 Metal Glaze thick lm element RoHS - Compatible Components Available Replaces costly surface-mount wirewound resistors red at 1000C High to solid ceramic 1 Watt and 1/2 Watt power rating temperature Up to triple the surge rating of the rugged CHP1 dielectric 150C maximum operating temperature Replaces costly surface-mount wirewound resistors coating RoHS - Compatible Components Available 60/40 Solder oHighver temperature Up to triple the surge rating of the rugged CHP1 nickel barrier dielectric Replaces costly surface-mount wirewound resistors coating 60/40 Solder over nickel barrier Electrical Data Electrical Data Maximum Resistance Tolerance TCR Product Industry IRC Working Maximum Maximum Resistance Tolerance TCR Product Industry IRC Working Maximum Power Rating Range (): (%) (ppm/C) Category Footprint Type Voltage Voltage Power Rating Range (): (%) (ppm/C) Category Footprint Type Voltage Voltage 2010 HSF-1/2 1/2W 70C 300 700 * 10 200 High Surge 2010 HSF-1/2 1/2W 70C 300 700 * 10 200 High Surge 2512 HSF-1 1W 70C 350 * * 10 200 High Surge 2512 HSF-1 1W 70C 350 * * 10 200 High Surge Note*: Consult factory for available resistance values and maximum voltage. Note*: Consult factory for available resistance values and maximum voltage. Environmental Data Characteristics Maximum Change Test Method Environmental Data Temperature Coef cient As speci ed MIL-R-55342H Par 4.7.9 (-55C +125C) Thermal Shock 0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65C +150C, 5 cycles) Characteristics Maximum Change Test Method Low Temperature Operation 0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65C working voltage) Temperature Coef cient As speci ed MIL-R-55342H Par 4.7.9 (-55C +125C) MIL-R-55342H Par 4.7.5 Short Time Overload 0.5% +0.01 ohm 2.5 x P x R f or 5 seconds Thermal Shock 0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65C +150C, 5 cycles) High Temperature Exposure 0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150C for 100 hours) Low Temperature Operation 0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65C working voltage) Resistance to Bonding 0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (re ow soldered to board at 260C for 10 seconds) Exposure MIL-R-55342H Par 4.7.5 Solderability 95% min. coverage MIL-STD-202, Method 208 (245C for 5 seconds) Short Time Overload 0.5% +0.01 ohm 2.5 x P x R for 5 seconds Moisture Resistance 0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours) Life Test 0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70C intermittent) High Temperature Exposure 0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150C for 100 hours) 1% +0.01 ohm Terminal Adhesion Strength 1200 gram push from underside of mounted chip for 60 seconds Resistance to Bonding no mechanical damage 0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (re ow soldered to board at 260C for 10 seconds) Exposure Chip mounted in center of 90mm long board, de ected 5mm so 1% +0.01 ohm Resistance to Board bending no mechanical damage as to exert pull on chip contacts for 10 seconds Solderability 95% min. coverage MIL-STD-202, Method 208 (245C for 5 seconds) General Note Moisture Resistance 0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours) General Note TT electronics reserves the right to make changes in product specification without notice or liability. IRC reserves the right to make changes in product speci cation without notice or liability. All information is subject to IRCs own data and is considered accurate at time of going to print. All information is subject to TT electronics own data and is considered accurate at time of going to print. A subsidiary of www.bitechnologies.com www.irctt.com www.welwyn-tt.com TT electronics plc Wire and Film Technologies Division 4222 South Staples Street Corpus Christi Texas 78411 USA Life Test 0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70C intermittent) T TT electrelephone: 361 992 7900 Fonics plcacsimile: 361 992 3377 Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 1 of 4 09. 11 1% +0.01 ohm Terminal Adhesion Strength 1200 gram push from underside of mounted chip for 60 seconds no mechanical damage Chip mounted in center of 90mm long board, de ected 5mm so 1% +0.01 ohm Resistance to Board bending no mechanical damage as to exert pull on chip contacts for 10 seconds General Note IRC reserves the right to make changes in product speci cation without notice or liability. All information is subject to IRCs own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc Wire and Film Technologies Division 4222 South Staples Street Corpus Christi Texas 78411 USA Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 1 of 4HSF High Surge Film Surface Mount Metal Glaze High Surge Film TM HSF Series Surface Mount Metal Glaze Physical Data L C W Dimensions (Inches and (mm)) Industry L W C IRC Type Footprint (Length) (Width/Diameter) (Termination Width) 0.200 0.010 0.079 0.006 0.030 0.010 2010 HSF-1/2 (5.08 0.25) (2.01 0.15) (0.761 0.25) 0.251 0.010 0.079 0.006 0.040 0.010 2512 HSF-1 (6.38 0.25) (2.01 0.15) (1.02 0.25) 0.367 0.010 0.105 0.006 0.050 0.010 3612 HSF-2 (9.32 0.25) (2.67 0.15) (1.27 0.25) Recommended Solder Pad Dimensions (Re ow): F A C A B E D Dimensions (Inches and mm)) Industry Footprint A B C D E F 0.111 0.126 0.096 0.152 0.040 0.211 HSF 1/2 2010 (1.93) (2.36) (1.47) (2.49) (0.81) (5.36) 0.121 0.126 0.127 0.183 0.040 0.369 HSF 1 2512 (3.07) (3.20) (3.23) (4.65) (1.02) (9.37) 0.17 0.16 0.213 0.273 0.044 0.553 HSF 2 3610 (4.32) (4.06) (5.41) (6.93) (1.12) (14.05) Wire and Film Technologies Division 4222 South Staples Street Corpus Christi Texas 78411 USA Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 2 of 4 General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics own data and is considered accurate at time of going to print. www.bitechnologies.com www.irctt.com www.welwyn-tt.com TT electronics plc 09. 11

Tariff Desc

8533.10.00 17 No Fixed carbon resistors, composition or film types Free

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